Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA

Brand Name:WITGAIN PCB
Certification:UL Certificate
Model Number:P10E3665AO
Minimum Order Quantity:negotiable
Delivery Time:25 work days
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Block 11, International E-Commerce Logistic Center, PingHu Street, LongGang Distric, ShenZhen City
Supplier`s last login times: within 13 hours
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Product Details

10 Layer HDI PCB Board , Printed Circuit Board , Blind And Buried Holes , Black Solder Mask


PCB Specifications:


Layer Count: 10 Layer HDI PCB

Material: FR4, TG170

Board Thickness: 1.0MM

Min Hole: 0.1MM

Hole Stucture: L1-L2,L2-L3,L3-L4,L5-L6,L6-L7,L7-L8,L8-L9,L9-L10,L1-L3,L8-L10,L2-L4,L7-L9,L1-L10

Min Trace: 2.5/2.5Mil

BGA: 7Mil

Aspect Ratio: 10:1

Solder Mas: Black

Surface Treatment: ENIG

Application: 5G Fiber Module


Capabilities:


ItemCapability
Layer Count1-24 Layers
Board Thickness0.1mm-6.0mm
Finished Board Max Size700mm* 800mm
Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
Warp<0.7%
Major CCL BrandKB/NanYa/LTEQ/ShengYi/Rogers Etc
Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
Drill Hole Diameter0.1mm-6.5mm
Out Layer Copper Thickness1/20Z-8OZ ;
Inner Layer Copper Thickness1/3OZ-6OZ
Aspect Ratio10:1
PTH Hole Tolerance+/-3mil
NPTH Hole Tolerance+/-1mil
Copper Thickness Of PTH Wall>10mil(25um)
Line Width And Space2/2mil
Min Solder Mask Bridge2.5mil
Solder Mask Alignment Tolerance+/-2mil
Dimension Tolerance+/-4mil
Max Gold Thickness200u'(0.2mil)
Thermal Shock288C, 10s, 3 Times
Impedance Contro+/-10%
LTest CapabilityPAD Size Min 0.1mm
Min BGA7mil
Surface TreatmentOSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

FAQ:


Question: How can you guarantee the quality of your products?

Answer: About electricty function, we will 100% test it through flying tester or fixture test. About the surface, we have IPQC and FQC and FQA to make sure the products with flaw do not flow to customer's side. We also do microsection and thermal shock to make sure the reliability of our products.


Question: What is the standard format you accept?

Answer: We accept standard gerber format file.


Question: Do you have MOQ requirements?

Answer: Because PCB is customized products, so we do have MOQ requirements. But the MOQ rquirement is not strict and it differs from case to case.


Question: What is the difference between your two factories?

Answer: The HuiZhou factory mainly produce sample and small batch pcbs. The JiangXi factory has more roboticized equipments, so it prefers big batch production.


Question: What is your shipping term?

Answer: EX WORK, FCA SHENZHEN, FOB SHENZHEN ,FOB HONGKONG, or FCA Customer's City, it depends on customers demand. But we prefer EX WORK and FCA SHENZHEN


Quesiont: What is ENIG?

Answer: ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed by a thin immersion Gold (Au) layer. ENIG provides good oxidation resistance, excellent surface planarity and allows for easy soldering which results in excellent electrical performance of the PCB board.


ENIG is RoHS compliant is therefore one of the most used PCB surface finishes even though it is more complex and expensive when compared to other PCB plating process like HASL.

ENIG is a two-layer metallic coating – Nickle is the barrier to the copper pad and is also the materials to which the components are soldered. Gold on the other hand protects the Nickle during storage and also provides low contact resistance. Typical Nickle thickness varies from 4 – 7 µm and Gold thickness varies from 0.05 – 0 23 µm. ENIG requires a processing temperature of around 80 °C.

Advantages of ENIG Surface Finishes:

  • It provides impressive wettability, surface planarity, coplanarity, and long shelf life (up to 12 months) to the PCB board since immersion gold has strong chemical properties.
  • In ENIG, the nickel layer acts as a barrier and stops the interfusion between gold and copper. It also produces an intermetallic compound (IMC) Ni3Sn4 to provide good solderability after reacting with Tin.
  • It has low contact resistance, high strength, reduces oxidation, and provides antifriction. Overall, it enhances circuit conductivity requirements.
  • It provides good plating over the copper pads and via holes.
  • Its excellent surface planarity allows the components to be soldered flat onto the pad, making it ideal for BGA pads and other fine-pitch components.
  • ENIG complies with all RoHS requirements.

Limitations of ENIG Surface Finishes:

  • ENIG is an expensive surface finish technology
  • It has undesirable magnetic properties
  • Not good for rework and makes PCB repair very difficult

China Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA supplier

Custom Green Fr4 HDI PCB Board / 10 Layer Pcb Black Solder Mask 7Mil BGA

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