99.9% Purity Red Rolled Electrodeposited Copper Foil
Brand Name:OEM
Certification:ISO / SGS / RoHS
Minimum Order Quantity:50kg
Delivery Time:10 - 15 Days
Payment Terms:L/C, T/T
Place of Origin:China
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Location:
Beijing Beijing China
Address:
Room 1601-1605, Building B, Jiatai International Building, No. 41 Dongsihuan Middle Road, Chaoyang District, Beijing
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99.9% Purity Red Rolled Electrodeposited Copper Foil
Description:
Electrolytic copper foil is a foil-based form of copper with a thickness generally less than 80micron. A rolled foil is made by annealing and rolling the electrolytic copper uninterruptedly.The production process involves electrodepositing copper to a rolling drum and then again rolling it up. For the process of electrodeposition, high-grade copper is dissolved in acid to form a copper electrolyte. This copper electrolyte solution is then pumped into electrically charged rotating drums. On drums, a thin film of copper is then electrodeposited. This process is also called as electrolytic plating. Electrolytic copper foils provide exceptional tensile strength as well as increased elongation characteristics. These foils are most commonly used as a superconductor in printed circuit boards as well as flexible connectors. Since, copper possesses high electrical conductivity, and is extraordinarily ductile and malleable,makes it one of the most extensively used metals in the everemerging electrical and electronics industry.
Feature:
1, symmetrical structure of both sides,99.9% copper density,very
low profile.
2, high elongation and tensile strength
3, very environmental,can be recycled
Technical Data:
| Classification | Unit | 9μm | 12μm | 18μm | 35μm | |
| Cu Content | % | ≥99.8 | ||||
| Area Weigth | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Tensile Strength | R.T.(23℃) | Kg/mm2 | ≥28 | |||
| H.T.(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Elongation | R.T.(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| H.T.(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Roughness | Shiny(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Peel Strength | R.T.(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
| Change of color(E-1.0hr/200℃) | % | Good | ||||
| Solder Floating 290℃ | Sec. | ≥20 | ||||
| Appearance(Spot and copper powder) | ---- | None | ||||
| Pinhole | EA | Zero | ||||
| Size Tolerance | Width | mm | 0~2mm | |||
| Length | mm | ---- | ||||
| Core | Mm/inch | Inside Diameter 79mm/3 inch | ||||
99.9% Purity Red Rolled Electrodeposited Copper Foil
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