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PCB Capability
Article | Description | Capability |
Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
Board Cutting | Number of layers | 1-48 |
Min.thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
Board Thickness | Standard | (0.1-4mm±10%) |
Min. | Single/Double:0.008±0.004” | |
4layer:0.01±0.008” | ||
8layer:0.01±0.008” | ||
Bow and twist | no more than 7/1000 | |
Copper Weight | Outer Cu weight | 0.5-4 0z |
Inner Cu weight | 0.5-3 0z | |
Drilling | Min size | 0.0078”(0.2mm) |
Drill deviation | ±0.002″(0.05mm) | |
PTH hole tolerance | ±0.002″(0.005mm) | |
NPTH hole tolerance | ±0.002″(0.005mm) | |
Solder Mask | Color | Green,white,black,red,blue… |
Min solder mask clearanace | 0.003″(0.07mm) | |
Thickness | (0.012*0.017mm) | |
Silkscreen | Color | white,black,yellow,blue… |
Min size | 0.006″(0.15mm) | |
Max Size of Finish Board | 700*460mm | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
PCB Outline | Square,circle,irregular(with jigs) | |
Package | QFN,BGA,SSOP,PLCC,LGA |
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