Module Hermetically Sealed Electronic Packages

Main performance parameters

• Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator
• Lead welding method: tin welding, gold wire bonding
• Nickel layer thickness: >3μm
• Gold layer thickness:> 0.45μm
• Hermeticity: leak rate ≤1x10^-3Pa.cm³/s (He)
• Insulation resistance: ≥1000MΩ (DC500V)
• material:
• Base: Kovar alloy, iron-nickel alloy, copper
• Ring frame: Kovar alloy, steel
• Lead: Kovar alloy, iron-nickel alloy, copper core composite
• Cover plate: Kovar alloy, iron-nickel alloy, steel
• Insulator: DM308 or similar, iron sealed glass beads, ceramic
• Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding

Founded in 1988 in Hefei, JOPTEC is a global leader in R&D and manufacturing of hermetic metal-glass packages for hybrid integrated circuits, high power laser, optical communication, infrared detector and other optoelectronic devices. With the continuous investment in new technologies and facilities, JOPTEC now covers an area of 21,000 square meters and has developed a complete and mature process for the design, manufacturing, testing and quality inspection for hermetic metal-glass packages. Over the past few decades, JOPTEC’s capability, quality consistency and reliability have been recognized by customers worldwide that range from major international companies of high power laser, optical communication, defense and aerospace agencies to medical and research establishments.