Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
Brand Name:JOPTEC
Minimum Order Quantity:50 PCS
Delivery Time:30 Days
Payment Terms:T/T
Place of Origin:HEFEI, CHINA
Supply Ability:5000000 PCS/Month
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Location:
Hefei Anhui China
Address:
No.451 Huangshan Road, Hefei, Anhui, China
Supplier`s last login times:
within 27 hours
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Product Details
Technical characteristics:
Micro channel heat sink
Flatness of chip mounting area ≤ 2 um
Roughness of chip mounting area ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Types of Ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn
Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
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