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High Removal Rate Poly Diamond Slurry for Polishing Sapphire Wafer
1. Poly diamond slurry/suspension with high removal rate, high selectivity, low damage and high cleaning
characteristic
2. Poly diamond slurry/suspension manufacturer for ten years
3. Certificates: ISO 9001:2008, ISO 14001; OHSAS18001
Our diamond slurries are made with diamond particles completely dispersed in the mixed liquids. 3 series according to the constituents:
Monocrystaline Diamond Slurry(MDS): Good removal effects, suitable for lapping & polishing of hard
material.
Polycrystaline Diamond Slurry(PDS): Superb tenacity & self-sharpening features. Suitable for lapping
and polishing of precision metal material, optical crystals,
ceramics and hard materials.
Nano Diamond Slurry(NDS): Good dispersing stability & suitable for precise surface
treatment.
Sizes Available
Size | Medium | MDS | PDS | NDS | Size | Medium | MDS | PDS | NDS |
0.05 | Water/Oil | √ | √ | √ | 1-3 | Water/Oil | √ | ||
0.08 | Water/Oil | √ | √ | √ | 2-4 | Water/Oil | √ | √ | |
0.1 | Water/Oil | √ | √ | √ | 3-6 | Water/Oil | √ | ||
0.15 | Water/Oil | √ | √ | √ | 4-8 | Water/Oil | √ | √ | |
0.2 | Water/Oil | √ | √ | √ | 5-10 | Water/Oil | √ | ||
0.25 | Water/Oil | √ | √ | √ | 6-12 | Water/Oil | √ | √ | |
0.5 | Water/Oil | √ | √ | √ | 8-16 | Water/Oil | √ | ||
0-1 | Water/Oil | √ | √ | 10-20 | Water/Oil | √ | |||
0.5-1 | Water/Oil | √ | √ | 15-25 | Water/Oil | √ | |||
0-2 | Water/Oil | √ | √ | 20-30 | Water/Oil | √ | |||
1-2 | Water/Oil | √ | 30-40 | Water/Oil | √ |
Main products: Monocrystal, Poly and Nano diamond and their
powders' series, CBN powder, slurry and polishing films. Our
products can meet and surpass international standard and enjoy a
high appraisal from customers from the USA, Europe, Korea, Japan
and Taiwan area.
Our company is proud of a strong professional managerial and
R&D team. Relying on ISO9000/14000 and OHSAS18000 systems, we
exert every effort to uplift our product quality, improve our
services and provide new varieties of products to the win-win goal
with our customers for sustainable development.
Characteristics:
★ Fine polycrystalline diamond materials.
★ Superhigh cutting force and surface finish in the processing of high hardness wafers.
★ Different carriers are suitable for different fields.
Available Sizes:
Size(μm) | 0.25 | 0.5 | 1 | 3 | 4 | 6 |
Media | Water/Oil | Water/Oil | Water/Oil | Water/Oil | Water/Oil | Water/Oil |
Remarks: Special sizes can be tailor-made.
Applications:
1. Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window film.
2. Ceramic processing: such as Zirconia fingerprint identification chip, Zirconia ceramic mobile phone back cover and other functional ceramics.
3. Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.