3-Layer Rogers PCB Board with RO3006 + Tg170 FR-4 Material 0.86mm Thickness and 98mm x 30mm Size

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-052.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details

This high-performance 3-layer rigid PCB is meticulously designed to meet the demanding requirements of various advanced electronic applications. With board dimensions of 98mm x 30mm (1 piece), it boasts precise construction details that ensure reliability and functionality.


PCB Specification

Construction DetailSpecification
Base materialRO3006 + Tg170 FR-4
Layer count3 layers
Board dimensions98mm x 30mm (1 piece)
Minimum Trace/Space4/4 mils
Minimum Hole Size0.3mm
Blind viasTop-Inn1, Inn1-Bot
Finished board thickness0.86mm
Finished Cu weightInner: 0.5 oz (0.7 mils); Outer layers: 1 oz (1.4 mils)
Via plating thickness20 μm
Surface finishOSP
SilkscreenNo
Solder MaskNo
Quality assurance (prior to shipment)100% Electrical test

PCB Stack-up

The 3-layer rigid PCB has a well-engineered stack-up as follows:

Layer/ MaterialThickness Specification
Copper_layer_135 μm
Rogers RO300610mil (0.254mm)
Copper_layer_235 μm
Prepreg0.1mm
FR-4 Core Tg1700.4mm
Copper_layer_335 μm


Artwork and Standards


Type of Artwork from customers: Gerber RS-274-X, a widely accepted format for PCB manufacturing data.


PCB Standard: Complies with IPC-Class-2, ensuring good quality and reliability for general electronic products.


Availability

This PCB is available worldwide, making it accessible for various global projects.


Introduction to RO3006

Rogers RO3006 laminates are ceramic-filled PTFE composites that offer exceptional electrical and mechanical stability. They are specifically designed for use in commercial microwave and RF applications. These advanced circuit materials provide a stable dielectric constant (Dk) over a range of temperatures, eliminating the step change in Dk that occurs for PTFE glass materials near room temperature.


Features of RO3006

-Ceramic-filled PTFE composites.

-Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C.

-Dissipation factor of 0.002 at 10 GHz/23°C, ensuring minimal signal loss.

-Td> 500°C, indicating high thermal resistance.

-Thermal Conductivity of 0.79 W/mK, facilitating efficient heat dissipation.

-Moisture Absorption of 0.02%, making it highly resistant to moisture-related issues.

-Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C, ensuring dimensional stability across a wide temperature range.



Benefits of RO3006

  • Uniform mechanical properties for a range of dielectric constants, making it ideal for multi-layer board designs with varying dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.

  • Low in-plane expansion coefficient (matching copper), allowing for more reliable surface mounted assemblies, making it ideal for applications sensitive to temperature change and providing excellent dimensional stability.

  • Volume manufacturing process with economical laminate pricing, ensuring cost-effectiveness for large-scale production.

Typical Applications

This PCB, with its use of RO3006, is well-suited for a variety of applications, including:


-Automotive radar applications.

-Global positioning satellite antennas.

-Cellular telecommunications systems - power amplifiers and antennas.

-Patch antenna for wireless communications.

-Direct broadcast satellites.

-Datalink on cable systems.

-Remote meter readers.

-Power backplanes.


Conclusion

This PCB, combining RO3006 and FR-4 materials with a 3-layer stack-up and precise craftsmanship, excels in high-frequency stability, heat dissipation, and dimensional control. It ensures quality through comprehensive electrical testing, making it a practical choice with both performance and reliability for various precision electronic applications.


China 3-Layer Rogers PCB Board with RO3006 + Tg170 FR-4 Material 0.86mm Thickness and 98mm x 30mm Size supplier

3-Layer Rogers PCB Board with RO3006 + Tg170 FR-4 Material 0.86mm Thickness and 98mm x 30mm Size

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