3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:China
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details

This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.


PCB details

ParameterSpecification
Base MaterialRO4003C / RO4450F
Layer Count3 Layers
Board Dimensions291mm x 155mm ± 0.15mm (2 Types, 2 PCS)
Minimum Trace/Space5/4 mils
Minimum Hole Size0.3mm
Blind ViasTop Layer to Inner Layer 1
Finished Board Thickness1.82mm
Finished Cu Weight1oz (1.4 mils) outer layers / 1oz inner layers
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskBlack
Bottom Solder MaskNo
Electrical Testing100% electrical test used prior to shipment

The stack-up of this 3-layer rigid PCB is structured as follows:


- Copper Layer 1: 35 μm

-Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 2: 35 μm

- Bonding Ply: RO4450F - 0.102 mm (4 mil)

- Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 3: 35 μm



Artwork and Quality Standards

The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.


Global Availability

This high-performance PCB is available worldwide, making it accessible for various applications across different markets.


Introduction to RO4003C

Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:


- Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz

- Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz

- Thermal Coefficient of Dielectric Constant: +40 ppm/°C

- Thermal Conductivity: 0.71 W/m/°K

- Low Moisture Absorption: 0.06%


The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.


Benefits

Rogers RO4003C offers numerous benefits, including:

- Ideal for multi-layer board constructions

- Lower fabrication costs compared to standard materials like FR-4

- Designed for performance-sensitive, high-volume applications

- Competitively priced, making it a popular choice


Typical Applications

RO4003C PCB is suitable for various applications, including:


- Cellular base station antennas and power amplifiers

- RF identification tags

- Automotive radar and sensors

- LNBs for direct broadcast satellites


Conclusion

The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.


China 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias supplier

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

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