M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:China
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Shenzhen Guangdong China
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6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
This 6-layer PCB crafted from high-performance Megtron6 (M6) R-5775G. Engineered for high-speed, low-loss applications, it is ideal for cutting-edge technologies such as 5G communication, automotive electronics, and high-performance computing.
Construction Details
This 6-layer PCB is meticulously engineered to meet the rigorous demands of today’s electronic devices. Here are the key construction details:
- Base Material: Megtron6 (M6) - R5775G (HVLP)
- Layer Count: 6 layers, allowing for complex circuit designs.
- Board Dimensions: 81.9 mm x 53.7 mm, with a tolerance of ±0.15
mm, ensuring precise fit in device enclosures.
- Minimum Trace/Space: 4/5 mils, facilitating high-density layouts.
- Minimum Hole Size: 0.3 mm, accommodating various component types.
- Finished Board Thickness: 1.4 mm, optimized for durability.
- Surface Finish: Electroless Nickel Electroless Palladium
Immersion Gold (ENEPIG), providing excellent solderability and
corrosion resistance.
| Property | Units | Test Method | Condition | Typical Value | ||
| THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
| DMA | As received | 210 | ||||
| Thermal Decomposition Temp | C | TGA | As received | 410 | ||
| Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
| With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
| CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
| Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
| Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
| CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
| ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
| Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
| Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
| Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
| PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
| Flammability | / | UL | C-48/23/50 | 94V-0 | ||
Stackup Configuration
The stackup of our PCB is designed for optimal performance in high-frequency applications:
Copper Layers: Multiple layers of copper ranging from 17 μm to 35 μm, strategically placed for effective signal transmission.
Prepreg Materials: R-5670(G) prepregs provide stability and
insulation between copper layers.
Core Material: M6 Core R5775G (HVLP) ensures low dielectric loss
and high thermal reliability.
Advantages of Megtron6 (M6) R-5775G
High-Speed Performance
Megtron6 laminate is specifically formulated for high-frequency
applications. With a dielectric constant of 3.4 at 1 GHz and 3.34
at 13 GHz, it minimizes signal loss, making it ideal for 5G
communications and other high-speed technologies.
Low Dielectric Loss
The dissipation factor of 0.002 at 1 GHz and 0.0037 at 13 GHz
ensures that energy is efficiently transmitted, reducing heat
generation and improving overall performance.
Thermal Reliability
The high Tg value (>185 °C) and thermal decomposition
temperature (Td) of 410 °C make this PCB suitable for environments
with significant thermal challenges, such as automotive and
aerospace applications.
Environmental Compliance
This PCB is RoHS compliant and halogen-free, aligning with global
standards for green manufacturing. This commitment to
sustainability is crucial for modern electronic design.
| PCB Material: | Low DK Glass Cloth |
| Designation: | Laminate R-5775(G), Prepreg R-5670(G) |
| Dielectric constant: | 3.61 10GHz |
| Dissipation Factor | 0.004 10GHz |
| Layer count: | Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Typical Applications
5G Communication: Base stations, millimeter-wave antennas, RF front-ends
Automotive Electronics: 77 GHz radar systems, ADAS
Data Centers: High-speed server motherboards, optical module PCBs
Aerospace: Circuit boards for satellite communication and radar
Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices
Conclusion
This PCB with Megtron6 material is a pivotal component in the
landscape of modern electronics. From high-speed communication to
automotive safety systems, its advanced features and materials
provide the foundation for innovative designs. As technology
continues to advance, this PCB stands ready to meet the challenges
of tomorrow’s high-performance applications. Embrace the future of
electronics with our sophisticated, reliable, and environmentally
responsible PCB solutions.
M6 High Speed Low Loss PCB 6-layer 1.4mm Thick ENEPIG Finish
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