M6 High Speed PCB Low Loss Multilayer 2mm Impedance Circuit Board

We are pleased to introduce a high speed PCB with Megtron 6 (M6)laminates,which is specifically engineered for applications in 5G communication, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). With its exceptional electrical and thermal properties, the M6 laminate ensures superior performance in high-frequency signal transmission, making it an ideal choice for advanced electronic devices.

Key Features of Megtron 6 (M6)
The M6 laminate stands out in the market due to its unique combination of properties, making it a preferred material for high-frequency and high-speed applications. Here are some of its standout features:

1. Low Dielectric Loss (Df):

Dissipation Factor: 0.002 at 1GHz/23°C, 0.0037 at 13GHz

Ensures minimal signal loss, making it ideal for high-frequency applications.

2. Stable Dielectric Constant (Dk):

Dk: 3.4 at 1GHz/23°C, 3.34 at 13GHz

Provides consistent signal transmission across a wide frequency range.

3. Excellent Thermal Reliability:

High Tg value: >185°C (DSC method), 210°C (DMA method)

Thermal Decomposition Temperature (Td): 410°C (TGA method)

Ensures stability under high-temperature conditions, making it suitable for demanding environments.

4. Low CTE (Coefficient of Thermal Expansion):

X/Y axis: 16 ppm/°C, Z axis: 45 ppm/°C

Reduces the risk of warping or delamination during thermal cycling.

5. Compatibility with FR-4 Processing:

No special equipment required, reducing production costs and simplifying manufacturing.

6. RoHS and Halogen-Free Compliance:

Meets global environmental standards for green manufacturing.

7. Flammability Rating: UL 94V-0

Ensures safety and reliability in high-temperature and high-stress environments.

16-Layer Rigid PCB Stackup Details
The M6 laminate supports 4 to 30-layer multilayer PCB designs, making it suitable for complex circuit requirements. Below is an example of a 16-layer rigid PCB stackup:

Copper Layers: 35 μm (outer layers), 17 μm (inner layers)

Prepreg Material: R-5670(G)

Core Material: M6 R5775G(HVLP)

Board Thickness: 2.0 mm

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Solder Mask: Green (top and bottom)

Silkscreen: White (top and bottom)

Via Plating Thickness: 25 μm

Minimum Trace/Space: 3/4 mils

Minimum Hole Size: 0.2 mm

Impedance Control
The M6 laminate ensures precise impedance control for high-frequency applications:

Single-Ended Impedance:

75Ω (L1, 11.8 mils, reference layer 4)

50Ω (L1/L16, 5.9 mils, reference layers 2/15)

Differential Impedance:

100Ω (L1, 5.9 mils/7.87 mils, reference layer 2)

100Ω (L10/L12, 3.94 mils/5.9 mils, reference layers 9/11/13)

PCB Construction Details
Board Dimensions: 110 mm x 110 mm (±0.15 mm)

Finished Copper Weight: 1 oz (outer layers), 0.5 oz/1 oz (inner layers)

Via Filling: 0.2 mm vias filled and capped

Electrical Testing: 100% tested prior to shipment

Quality Standard: IPC-Class-2

Typical Applications
The Megtron 6 (M6) R-5775 laminate is widely used in the following industries:

5G Communication: Millimeter-wave antennas, RF front-ends for AAU (Active Antenna Unit).

Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems).

Data Centers: High-speed server motherboards, 400G/800G optical module PCBs.

Aerospace: High-frequency circuit boards for satellite communication and radar systems.

Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices.

Why Choose Megtron 6 (M6) PCB?
High Performance: Optimized for high-frequency and high-speed applications.

Cost-Effective: Compatible with traditional FR-4 processing technology.

Reliability: Excellent thermal and electrical properties ensure long-term stability.

Global Availability: Ready to ship worldwide

Contact Us for Inquiries
If you’re looking for high-quality PCBs using Megtron 6 (M6) laminate, we’re here to help. Whether you’re working on 5G infrastructure, automotive electronics, or high-performance computing, we have the expertise to deliver reliable and cost-effective solutions.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners