Double-Sided F4BTMS1000 PCB 6.35mm Thick Bare Copper Circuits

The F4BTMS1000 PCB is introduced as the latest innovation in the F4BTMS series, designed to meet the rigorous demands of high-reliability applications in aerospace and defense sectors. This upgraded version of the F4BTM series incorporates significant advancements in material formulation and manufacturing processes, resulting in exceptional performance and versatility.

Advanced Material Composition
Crafted from a unique blend of specially formulated nano-ceramics mixed with polytetrafluoroethylene (PTFE) resin, reinforced with ultra-thin and ultra-fine glass fiber cloth, the F4BTMS1000 minimizes the negative impacts of glass fiber on electromagnetic wave propagation. This innovative composition is designed to greatly reduce dielectric loss while enhancing dimensional stability. A broader range of dielectric constants is provided, making the material suitable for various applications.

Key benefits of the F4BTMS1000 include improved electrical strength and thermal conductivity, as well as a low thermal expansion coefficient. These features ensure stable dielectric temperature characteristics and increased usability across a wide frequency range. Additionally, RTF low roughness copper foil is incorporated into the F4BTMS series, further reducing conductor loss and providing excellent peel strength, allowing compatibility with both copper and aluminum bases.

Key Features of the F4BTMS1000
Dielectric Constant (Dk): The F4BTMS1000 boasts a Dk of 10.2 at 10GHz, making it ideal for high-frequency applications where precise signal transmission is critical.

Dissipation Factor: With values of 0.0020 at 10GHz and 0.0023 at 20GHz, the PCB minimizes energy loss during operation.

Coefficient of Thermal Expansion (CTE): The CTE values of 16 ppm/°C (X-axis), 18 ppm/°C (Y-axis), and 32 ppm/°C (Z-axis) ensure stability across a wide temperature range from -55°C to 288°C.

Low Thermal Coefficient of Dk: At -320 ppm/°C, this feature guarantees consistent performance under temperature variations, enhancing design reliability.

High Thermal Conductivity: At 0.81 W/mk, this PCB promotes efficient heat dissipation, crucial for maintaining optimal operating conditions.

Low Moisture Absorption: With a moisture absorption rate of 0.03%, the F4BTMS1000 is designed to perform reliably in humid environments.

Construction Specifications
The F4BTMS1000 PCB features a robust 2-layer rigid construction with the following specifications:

Copper Layer 1: 35 μm
F4BTMS1000 Core: 6.35 mm (250 mil)
Copper Layer 2: 35 μm

The board dimensions are 98 mm x 98 mm (± 0.15 mm), with a finished thickness of 6.4 mm. A finished copper weight of 1 oz (1.4 mils) is specified for outer layers, ensuring optimal conductivity.

Additional Construction Details
Minimum Trace/Space: 6/6 mils
Minimum Hole Size: 0.6 mm
Via Plating Thickness: 20 μm
Surface Finish: Bare copper, providing excellent conductivity.
Electrical Testing: Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.

Quality Assurance and Standards
Manufacturing is conducted in compliance with IPC-Class-2 standards, ensuring a moderate level of reliability appropriate for a variety of applications. This commitment to quality guarantees that each F4BTMS1000 PCB meets stringent performance benchmarks, providing peace of mind for customers in critical industries.

Typical Applications
The F4BTMS1000 PCB is ideally suited for a variety of high-reliability applications, including:

Aerospace Equipment: Essential for space and cabin equipment that requires consistent performance in extreme conditions.

Microwave and RF Applications: Perfect for advanced microwave components, ensuring signal integrity and minimal loss.

Military Radar: Designed to meet the precision demands of military applications.

Feed Networks and Phase-Sensitive Antennas: Ideal for phased array antennas and satellite communications.

Conclusion
The F4BTMS1000 PCB represents a significant leap forward in PCB technology, combining advanced materials and rigorous manufacturing processes to deliver unmatched performance and reliability. Whether utilized in aerospace, military, or telecommunications, this PCB is engineered to meet the challenges of modern electronics.

Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

Main Business & PCB Applications

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main Material Partners