Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:CHINA
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Shenzhen Guangdong China
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Product Details
Introducing the Rogers RO4350B PCB, a state-of-the-art solution designed for high-frequency applications. Made from proprietary woven glass reinforced hydrocarbon/ceramics, RO4350B offers electrical performance comparable to PTFE/woven glass while maintaining the manufacturability advantages of epoxy/glass composites. This material is engineered to provide tight control over dielectric constant (Dk) and low loss, all at a fraction of the cost of conventional microwave laminates.
RO4350B laminates do not require special through-hole treatments or handling procedures, making them easier to work with than PTFE-based materials. Rated UL 94 V-0, they are ideal for active devices and high-power RF designs, ensuring reliability and performance.
Key Features
1. Dielectric Constant: 3.48 ± 0.05 at 10 GHz/23°C, ensuring
reliable signal integrity for RF applications.
2. Dissipation Factor: Low at 0.0037 at 10 GHz/23°C, minimizing signal loss.
3. Thermal Conductivity: 0.69 W/m/°K, facilitating effective heat
management.
4. Thermal Coefficient of Expansion (CTE): X axis at 10 ppm/°C, Y axis at 12 ppm/°C, and Z axis at 32 ppm/°C, providing excellent dimensional stability.
5. High Tg Value: Greater than 280 °C, ensuring stability during thermal processing.
6. Water Absorption: Low at 0.06%, enhancing reliability in various environments.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits
1. Multi-Layer Board Compatibility: Ideal for MLB constructions,
ensuring excellent dimensional stability.
2. Cost-Efficient Processing: Processes like FR-4, resulting in
lower fabrication costs.
3. Reliable Thermal Performance: Low Z-axis CTE provides consistent
plated through-hole quality, even under thermal stress.
PCB Specifications
This PCB is designed as a 2-layer rigid board with dimensions
measuring 45 mm x 66 mm, with a tolerance of ±0.15 mm. It features
two copper layers, each with a thickness of 35 μm, sandwiching a
core of Rogers RO4350B material that is 0.168 mm (6.6 mil) thick.
The finished board thickness is 0.25 mm, and the outer layers have
a copper weight of 1 oz (1.4 mils).
The via plating is set at a thickness of 20 μm, and the surface finish is achieved through immersion silver. Notably, the board does not include silkscreen or solder mask on either side. Prior to shipment, each PCB undergoes a rigorous 100% electrical testing process to ensure reliability and performance.
Artwork and Standards
The Rogers RO4350B PCB comes with Gerber RS-274-X artwork and meets
IPC-Class-2 quality standards, ensuring reliability and performance
in demanding applications.
Availability
Our Rogers RO4350B PCBs are available for worldwide shipping,
making it easy for engineers and designers to access this advanced
technology for their projects.
Typical Applications
The Rogers RO4350B PCB is ideal for a wide range of applications,
including:
-Cellular base station antennas and power amplifiers
-RF identification tags
-Automotive radar systems and sensors
-LNBs for direct broadcast satellites
Rogers RO4350B PCB 6.6mil Double-Layer Immersion Silver Circuit Board
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