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Introduction to the AD255C PCB
In the fast-paced world of telecommunications, the choice of
materials can make or break the performance of your devices. The
AD255C antenna PCB stands at the forefront of innovation, boasting
glass-reinforced, PTFE-based laminates that deliver exceptional
dielectric properties and low loss performance. Designed for a
variety of microwave and RF applications, the AD255C is a
game-changer for cellular infrastructure and automotive telematics.
Key Features and Specifications
Low Loss and High Efficiency
The AD255C substrate is engineered with a dielectric constant of
2.55 and a dissipation factor of just 0.0013 at 10 GHz. This
combination ensures minimal signal loss, crucial for maintaining
the integrity of high-frequency signals. With a decomposition
temperature exceeding 500°C, the material withstands demanding
thermal conditions, making it reliable for long-term use.
Tailored for Performance
This PCB features a 2-layer rigid stackup with a finished thickness
of 1.1mm and copper weights of 1oz on the outer layers. This
construction not only enhances mechanical strength but also
guarantees robust electrical performance, ensuring that your
communication devices operate seamlessly.
Moisture and Thermal Resistance
With a moisture absorption rate of only 0.03%, the AD255C PCB is
built to resist environmental challenges, ensuring consistent
performance in various conditions. Furthermore, the thermal
properties are noteworthy, featuring coefficients of thermal
expansion (CTE) of 34 ppm/°C in the X-axis and 26 ppm/°C in the
Y-axis, which contribute to its phase stability.
Electrical Properties | AD255C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.55 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.60 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -110 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 7.4 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 3.6 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 911 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 34 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 26 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.35 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.4 (13.6) | N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 8.1/6.6 (55.8/45.5) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 930/818 (6,412/5,640) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.03/0.07 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.03 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Benefits of the AD255C Antenna PCB
Enhanced Signal Integrity
The AD255C PCB is designed to minimize insertion loss and passive
intermodulation (PIM), crucial for antenna applications. With PIM
values reaching as low as -163 dBc, this PCB ensures clear and
reliable communication, essential for base station antennas.
Compatibility and Reliability
Its compatibility with standard PTFE-based PCB processing
techniques allows for easy integration into existing manufacturing
workflows. Each unit undergoes 100% electrical testing prior to
shipment, ensuring that you receive a product that meets high
industry standards.
PCB Material: | Glass-reinforced, PTFE based Composites |
Designation: | AD255C |
Dielectric constant: | 2.55 (10 GHz) |
Dissipation Factor | 0.0013 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Applications
The versatility of the AD255C makes it suitable for a wide range of
applications, including:
- Cellular Infrastructure Base Station Antennas: Essential for
maintaining robust mobile communication networks.
- Automotive Telematics Systems: Providing connectivity and
navigation solutions for modern vehicles.
- Commercial Satellite Radio Antennas: Ensuring high-fidelity signal transmission for satellite communications.
Conclusion
When it comes to choosing a PCB for microwave and RF applications,
the AD255C antenna PCB emerges as a top contender. With its
exceptional specifications, low loss characteristics, and robust
design, it is tailored to meet the rigorous demands of modern
telecommunications. Elevate your projects with the AD255C and
experience unparalleled performance and reliability.
Whether you are in cellular infrastructure or satellite communications, the AD255C is your go-to solution for superior signal integrity and efficiency. Contact us today if you have any inquiry about PCB project.