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Introduction:
In the fast-paced world of electronics, demand for high-performance
printed circuit boards (PCBs) continues to rise. The recently
shipped RO4003C PCB is a breakthrough solution that enables the
realization of cutting-edge applications requiring high operating
frequencies, stability, and reliability. This article delves into
the features, benefits, construction details, statistics, and
typical applications of the RO4003C PCB, highlighting its
significant advantages for the electronics industry.
1. Features:
The RO4003C substrate boasts an array of features that make it a
standout choice for high-frequency applications:
a) Rogers RO4003C Woven Glass Reinforced Hydrocarbon/Ceramics:
The RO4003C PCB is constructed using Rogers' advanced RO4003C
material, a woven glass reinforced hydrocarbon/ceramics substrate.
This unique composition provides exceptional electrical
performance, stability, and dimensional accuracy.
b) Dielectric Constant (DK) of 3.38 +/- 0.05 at 10GHz:
With a low dielectric constant and tight tolerance, the RO4003C PCB
ensures precise signal propagation, minimizing losses and
maximizing signal integrity.
c) Dissipation Factor of 0.0027 at 10GHz:
The low dissipation factor of the RO4003C PCB enables efficient
energy transfer, reducing signal attenuation and supporting
high-frequency applications.
d) Thermal Conductivity of 0.71 W/m/°K:
The PCB's high thermal conductivity facilitates effective heat
dissipation, ensuring optimal performance and reliability even
under demanding conditions.
e) Coefficient of Thermal Expansion (CTE):
The RO4003C PCB exhibits a low Z-axis expansion and controlled
expansion coefficients in the X, Y, and Z axes, making it highly
stable across a wide range of temperatures.
f) Tg > 280 °C:
With a high glass transition temperature (Tg), the RO4003C PCB can
withstand elevated temperatures, making it suitable for
applications that involve harsh operating conditions.
g) -40℃ to +85℃ Operation:
The PCB is designed to operate reliably in a temperature range from
-40℃ to +85℃, ensuring its suitability for various environments.
RO4003C Typical Value | |||||
Property | RO4003C | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-free Process Compatible | Yes |
2. Benefits:
The RO4003C PCB offers several benefits that make it an ideal
choice for high-frequency and broadband applications:
a) Low Dielectric Tolerance and Low Loss:
The PCB's low dielectric tolerance and low loss characteristics
enable efficient signal transmission, minimizing signal degradation
and maximizing system performance.
b) Excellent Electrical Performance:
With stable electrical properties across a wide frequency range,
the RO4003C PCB ensures consistent signal integrity and enables the
design of high-performance filters and transmission lines.
c) Controlled Impedance Transmission Lines:
The PCB's properties allow for the creation of controlled impedance
transmission lines, ensuring accurate signal matching and
minimizing reflections, resulting in improved signal quality.
d) Excellent Dimensional Stability:
The RO4003C PCB exhibits excellent dimensional stability, ensuring
consistent performance and enabling precise manufacturing and
assembly processes.
e) Reliable Plated Through Holes:
The low Z-axis expansion and CAF resistance of the RO4003C PCB
contribute to the reliability and longevity of plated through
holes, enhancing overall PCB durability.
f) Remains Stable over a Wide Range of Temperatures:
The PCB's low in-plane expansion coefficient ensures stability
throughout the circuit processing temperature range, allowing for
consistent performance during manufacturing and operation.
g) Volume Manufacturing Process and Competitive Pricing:
RO4003C laminates can be fabricated using standard glass epoxy
processes, making them compatible with volume manufacturing.
Additionally, the PCB's competitive pricing offers cost-effective
solutions for various applications.
3. PCB Stackup and Construction Details:
This PCB follows a 2-layer rigid PCB stackup, with copper layers on
both sides of the RO4003C core. The construction details are as
follows:
- Copper Layer 1: 35 μm
- Rogers 4003C Core: 0.813 mm (32 mil)
- Copper Layer 2: 35 μm
The board dimensions are 1200mm x 300mm, with a tolerance of +/- 0.15mm. This PCB supports a minimum trace/space of 6/6 mils and a minimum hole size of 0.5mm. It does not incorporate blind vias. The finished board thickness is 0.9mm, with a finished outer layer copper weight of 1oz (1.4 mils). Via plating thickness is 20 μm, and the surface finish is immersion gold. The top silkscreen is black, and there is no bottom silkscreen or solder mask.
Every PCB undergoes a 100% electrical test before shipment, ensuring the highest quality standards.
4. PCB Statistics:
This PCB is equipped to handle complex electronic designs, with the
following statistics:
- Components: 51
- Total Pads: 232
- Thru Hole Pads: 171
- Top SMT Pads: 61
- Bottom SMT Pads: 0
- Vias: 120
- Nets: 4
5. Type of Artwork Supplied: Gerber RS-274-X
This RO4003C PCB accepts Gerber RS-274-X artwork, ensuring
compatibility with industry-standard design tools and facilitating
seamless integration into existing manufacturing processes.
6. Quality Standard: IPC-Class-2
The RO4003C PCB adheres to the IPC-Class-2 quality standard,
guaranteeing reliable performance and consistent manufacturing
quality.
7. Availability: Worldwide
The RO4003C PCB is available for purchase and shipment worldwide,
making it accessible to designers and manufacturers across the
globe.
8. Some Typical Applications:
The versatility and performance characteristics of the RO4003C PCB
make it well-suited for a wide range of applications, including:
- Cellular Base Station Antennas and Power Amplifiers: The high-frequency capabilities and stability of the RO4003C PCB make it an ideal choice for cellular base station antennas and power amplifiers, where reliable signal transmission and efficient energy transfer are crucial.
- RF Identification Tags: The low dielectric tolerance and controlled impedance transmission lines of the PCB enable highly accurate and reliable RF identification tag systems.
- Automotive Radar and Sensors: The RO4003C PCB's stable electrical properties and low loss characteristics make it an excellent choice for automotive radar and sensor systems, where precise signal transmission and detection are essential.
- LNB's for Direct Broadcast Satellites: The PCB's low dielectric tolerance, low loss, and controlled impedance transmission lines are advantageous for LNB (Low Noise Block) applications in direct broadcast satellites, enabling high-quality signal reception and processing.
Conclusion:
The RO4003C PCB represents a significant advancement in
high-frequency PCB technology, offering exceptional electrical
performance, stability, and reliability. With its low dielectric
tolerance, controlled impedance transmission lines, and dimensional
stability, the RO4003C PCB opens up new possibilities for
applications requiring high operating frequencies and stringent
performance standards. Whether in cellular base stations, RF
identification, automotive radar, or satellite systems, the RO4003C PCB provides the foundation for superior performance,
enabling engineers and designers to push the boundaries of
technology.