0.813mm 2L RF PCB Made Of RO4003C Laminates For High Frequency Applications
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:CHINA
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Introduction:
It's very happy to introduce our newly shipped PCB which made of
RO4003C laminates. RO4003C laminates are cost-effective microwave
materials known for their precise control over dielectric constant
(ε) and low loss. They are available in different configurations,
utilizing 1080 and 1674 glass fabric styles. Unlike PTFE-based
microwave materials, RO4003C laminates do not require special
handling procedures or through-hole treatments. These laminates are
non-brominated and do not have a UL 94 V-0 rating.
Features:
RO4003C laminates are composed of woven glass reinforced
hydrocarbon/ceramics. They have a dielectric constant (DK) of 3.38
± 0.05 at 10 GHz and a dissipation factor (tan δ) of 0.0027 at the
same frequency. The laminates exhibit a thermal conductivity of
0.71 W/m/°K. The coefficient of thermal expansion (CTE) is 11
ppm/°C in the X-axis, 14 ppm/°C in the Y-axis, and 46 ppm/°C in the
Z-axis. The glass transition temperature (Tg) is greater than 280
°C, and the laminates can operate within a temperature range of
-40℃ to +85℃.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits:
RO4003C laminates offer excellent electrical performance with low
dielectric tolerance and low loss. They maintain stable electrical
properties across a wide frequency range. The laminates exhibit a
low thermal coefficient of dielectric constant, providing
dimensional stability. They also offer reliable plated through
holes with low Z-axis expansion. With a low in-plane expansion
coefficient, RO4003C laminates remain stable over a range of
circuit processing temperatures. Moreover, these laminates are
cost-effective compared to conventional microwave laminates. They
are also resistant to conductive anodic filamentation (CAF).
PCB Stackup:
This PCB is a 2-layer rigid construction, the stackup consists of a
35 μm copper layer on the top, a 0.813 mm (32 mil) RO4003C core,
and another 35 μm copper layer on the bottom.
PCB Construction Details:
The dimensions for this PCB.It's two types of the design. The size
are 265mm x 66.88mm with a tolerance of +/- 0.15mm. The minimum
trace/space is 6/5 mils, and the minimum hole size is 0.35mm. The
PCB does not have blind vias, and the finished board thickness is
0.9mm. The outer copper layer weight is 1 oz (1.4 mils), and the
via plating thickness is 20 μm. The surface finish is immersion
gold, while the top and bottom silkscreens are white. The solder
masks are green on both sides. A 100% electrical test is conducted
prior to shipment.
PCB Statistics:
This PCB consists of 66 components and has a total of 153 pads,
including 81 through-hole pads and 72 top surface mount technology
(SMT) pads. The PCB does not have bottom SMT pads. It includes 120
vias and 4 nets.
Supplied Artwork Type and Quality Standard:
The supplied artwork type is Gerber RS-274-X, and the quality
standard is IPC-Class-2.
Availability:
This PCB made of RO4003C laminates are available worldwide.
Typical Applications:
RO4003C laminates are commonly used in cellular base station
antennas and power amplifiers, RF identification tags, automotive
radar and sensors, and LNBs (Low Noise Block downconverters) for
direct broadcast satellites.
0.813mm 2L RF PCB Made Of RO4003C Laminates For High Frequency Applications
Inquiry Cart
0