0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:CHINA
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Introducing our newly shipped PCB, featuring cutting-edge technology and exceptional performance. This 2-layer rigid PCB is constructed using high-quality Rogers AD255C Woven Glass Reinforced PTFE Antenna Grade Laminates, ensuring unparalleled reliability and functionality. With a dielectric constant of 2.55 and a tight tolerance at 10 GHz/23°C, this PCB guarantees optimal signal integrity and stability.


Engineered with a focus on low loss and superior performance, the substrate incorporates a very low loss PTFE and ceramic filled composite.


The low profile copper and lower insertion loss further enhance its efficiency, making it an ideal choice for antenna applications. This PCB boasts low PIM (Passive Intermodulation) that ensures minimal interference and distortion in antenna systems.


Electrical PropertiesAD255CUnitsTest ConditionsTest Method
PIM (30mil/60mil)-159/-163dBcReflected 43 dBm swept tones at 1900 MHz, S1/S1Rogers Internal 50 ohm
Dielectric Constant (process)2.55-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design)2.60-C-24/23/5010 GHzMicrostrip Differential Phase Length
Dissipation Factor (process)0.0013-23°C @ 50% RH10 GHzIPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant-110ppm/ºC0°C to 100°C10 GHzIPC TM-650 2.5.5.5
Volume Resistivity7.4 x 108Mohm-cmC-96/35/90-IPC TM-650 2.5.17.1
Surface Resistivity3.6 x 107MohmC-96/35/90-IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)911V/mil--IPC TM-650 2.5.6.2
Dielectric Breakdown>40kVD-48/50X/Y directionIPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td)>500˚C2hrs @ 105˚C5% Weight LossIPC TM-650 2.3.40
Coefficient of Thermal Expansion - x34ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - y26ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - z196ppm/˚C--55˚C to 288˚CIPC TM-650 2.4.41
Thermal Conductivity0.35W/mK-z directionASTM D5470
Time to Delamination>60minutesas-received288˚CIPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress2.4
(13.6)
N/mm (lbs/in)10s @288˚C35 μm foilIPC TM-650 2.4.8
Flexural Strength (MD/CMD)8.8/6.4 (60.7/44.1)MPa (ksi )25°C ± 3°C-ASTM D790
Tensile Strength (MD/CMD)8.1/6.6 (55.8/45.5)MPa (ksi )23°C/50% RH-ASTM D3039/D3039-14
Flex Modulus (MD/CMD)930/818 (6,412/5,640)MPa (ksi )25°C ± 3°C-IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD)0.03/0.07mils/inchafter etch + bake-IPC-TM-650 2.4.39a
Physical Properties
FlammabilityV-0---UL-94
Moisture Absorption0.03%E1/105 +D48/50-IPC TM-650 2.6.2.1
Density2.28g/cm3C-24/23/50-ASTM D792
Specific Heat Capacity0.813J/g°K2 hours at 105°C-ASTM E2716

One of the standout features of this PCB is its remarkable phase stability, attributed to the excellent TCEr (Thermal Coefficient of Expansion). This ensures consistent performance even under varying temperature conditions. Additionally, this PCB is compatible with the processing techniques used for standard PTFE-based PCB substrates, making it easy to incorporate into existing designs and manufacturing processes.


The stackup of this PCB consists of two layers, with a copper layer thickness of 35 μm on both sides. The AD255C substrate, measuring 0.762 mm (30 mil), provides excellent stability and durability. With a finished board thickness of 0.8mm, this PCB strikes the perfect balance between compactness and robustness.


It features a board dimension of 175.42mm x 143.84mm, allowing for versatile usage in various applications. The minimum trace/space of 5/5 mils and minimum hole size of 0.3mm provide flexibility and precision in circuit design. The absence of blind vias simplifies the manufacturing process, ensuring cost-effectiveness and ease of production.


PCB Material:Glass-reinforced, PTFE based Composites
Designation:AD255C
Dielectric constant:2.55 (10 GHz)
Dissipation Factor0.0013 (10 GHz)
Layer count:Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness:20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

To ensure reliability, each PCB undergoes a 100% electrical test before shipment, guaranteeing optimal performance upon arrival. The surface finish is Immesion Tin, providing excellent corrosion resistance and solderability. The top solder mask is green, while the top silkscreen is white, facilitating clear labeling and identification of components.



With 26 components and 82 pads, including 29 thru-hole pads and 53 top SMT pads, this PCB offers extensive versatility for various applications. It features 54 vias and 4 nets, enabling efficient signal routing and connectivity.


This PCB meets IPC-Class-2 standards, it is built to withstand demanding environments and deliver consistent performance. Its applications range from cellular infrastructure base station antennas to automotive telematics antenna systems and commercial satellite radio antennas.


We proudly offer worldwide availability, ensuring that our PCB can be accessed and utilized wherever you are. For any technical inquiries or further information, please contact our dedicated sales team at sales10@bichengpcb.com.


Choose our advanced PCB solution and experience unrivaled performance and reliability in your electronic projects.

China 0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin supplier

0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

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