Kappa 438 High Frequency PCB With Immersion Gold For Carrier Grade WiFi

Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
Place of Origin:CHINA
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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In today's discussion, we'll delve into the world of Rogers Kappa 438 PCBs, an exceptional choice for wireless circuit designers seeking an alternative to FR-4 materials. These PCBs offer enhanced performance, consistency, and reliability while remaining cost-effective and user-friendly.


Kappa 438 laminates are designed with a hydrocarbon ceramic system reinforced with glass. This unique composition allows for the use of standard epoxy/glass (FR-4) processes during circuit fabrication, simplifying the manufacturing process.


Key Features of Kappa 438 Laminates:


Flame Retardancy: Kappa 438 laminates are rated UL 94 V-0, ensuring high flame retardancy and safety.


Compatibility with Lead-Free Soldering: These laminates are compatible with lead-free solder processes, meeting the industry's environmental requirements.

Let's explore the typical properties of Kappa 438 laminates:


Dielectric Performance:

Dielectric Constant: At 2.5 GHz, the dielectric constant of Kappa 438 is 4.38, ensuring excellent signal propagation.


Low Dissipation Factor: The dissipation factor is 0.005 at 10 GHz and 23°C, indicating minimal signal loss.


Thermal Stability:

Thermal Coefficient of Dielectric Constant: Kappa 438 exhibits a thermal coefficient of -21 ppm/°C at 10 GHz over a wide temperature range of -50°C to 150°C, ensuring consistent performance under varying temperatures.


High Thermal Conductivity: With a thermal conductivity of 0.64 W/(m.K) at 80°C, Kappa 438 efficiently dissipates heat, preventing overheating of electronic components.


Dimensional Stability: Kappa 438 boasts a dimensional stability of -0.48 mm/m (MD) and -0.59 mm/m (CMD), as measured using the IPC-TM-650 2.4.39a test method, ensuring minimal warping or deformation during manufacturing and use.


Mechanical Strength and Durability:

Tensile and Flexural Strength: Kappa 438 exhibits tensile strengths of 16 kpsi (MD) and 12 kpsi (CMD), as well as flexural strengths of 25 kpsi (MD) and 19 kpsi (CMD), providing robust mechanical support to circuitry.


Coefficient of Thermal Expansion (CTE): With a CTE of 13 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 42 ppm/°C (Z-axis), Kappa 438 maintains stability and minimal dimensional changes across different temperature ranges.


Young's Modulus and Flex Modulus: Kappa 438 displays a high Young's modulus of 2264 kpsi and a flex modulus of 2337 kpsi, indicating its ability to withstand mechanical stress without deformation or breaking.


Copper Peel Strength: The material has a copper peel strength value of 5.8 lbs/in for 1 oz (35 µm) foil, ensuring excellent adhesion and resistance to thermal stress.


PropertyKappa 438DirectionUnitsConditionTest Method
Dielectric Constant, er Design4.38Z-2.5 GHzDifferential Phase Length Method
Dissipation Factor tan0.005Z-10 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant-21-ppm/°C10 GHz (-50 to 150°C)Modified IPC-TM-650 2.5.5.5
Volume Resistivity2.9 x 109-MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity6.2 x 107-MΩCOND AIPC-TM-650 2.5.17.1
Electrical Strength675ZV/mil-IPC-TM-650 2.5.6.2
Tensile Strength16 12MD CMDkpsi-ASTM D3039/D3039-14
Flexural Strength25 19MD CMDkpsi-IPC-TM-650 2.4.4
Dimensional Stability-0.48 -0.59MD CMDmm/m-IPC-TM-650 2.4.39a
Coefficient of Thermal Expansion13Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
16Y
42Z
Thermal Conductivity0.64ZW/(m.K)80°CASTM D5470
Time to Delamination (T288)>60-minutes288°CIPC-TM-650 2.4.24.1
Tg>280-°C TMA-IPC-TM-650 2.4.24.3
Td414-°C-IPC-TM-650 2.3.40
Moisture Absorption0.07-%24/23IPC-TM-650 2.6.2.1
Young’s Modulus2264 2098MD CMDkpsi-ASTM D3039/D3039-14
Flex Modulus2337 2123MD CMDkpsi-IPC-TM-650 2.4.4
Bow0.03-%-IPC-TM-650 2.4.22C
Twist0.08-%-IPC-TM-650 2.4.22C
Copper Peel Strength After Thermal Stress5.8-lbs/in1 oz (35 µm) foilIPC-TM-650 2.4.8
FlammabilityV-0---UL 94
Specific Gravity1.99-g/cm3-ASTM D792
Lead-Free Process CompatibleYes---


Temperature Resistance: Kappa 438 has a Tg (glass transition temperature) greater than 280°C, allowing it to withstand high temperatures without compromising its mechanical properties or becoming brittle.Other Essential Properties:


Flame Retardancy: The material is rated V-0 according to UL 94, signifying its self-extinguishing properties and non-propagation of flames.

Moisture Resistance: With a moisture absorption rate of 0.07%, Kappa 438 is highly resistant to water and remains unaffected by moisture in the device's environment.


Delamination Resistance: The material can withstand high temperatures for over 60 minutes at 288°C without delamination, ensuring its durability in demanding conditions.


Specific Gravity: Kappa 438 has a specific gravity value of 1.99 g/cm³, indicating its relative density and ability to provide mechanical support to electronic components.


Kappa 438 PCB Capability:

Layer Counts: Kappa 438 PCBs are available in various layer counts, including double layer, multi-layer, and hybrid configurations.


Copper Weights: Customers can choose between copper weights of 1oz (35µm) or 2oz (70µm) to suit their specific design requirements.


Thickness Options: Kappa 438 is available in thicknesses of 20mil, 30mil, 40mil, and 60mil, providing flexibility for different applications.


Maximum Size: The maximum size of Kappa 438 PCBs is 400mm X 500mm, making it suitable for a wide range of electronic devices.


Solder Mask Colors: Customers have the freedom to select from a variety of solder mask colors, including green, black, blue, yellow, red, and more, allowing for customization and visual appeal.


Surface Finish Options: Kappa 438 PCBs can be finished with various surface finishes, such as immersion gold, HASL, immersion silver, immersion tin, pure gold, OSP, ENEPIG, bare copper, and others, catering to specific application requirements.


PCB material:Glass Reinforced Hydrocarbon Ceramic Substrates
Designation:Kappa 438
Dielectric constant:4.38
Layer count:Double layer, Multi-layer, Hybrid PCB
Copper weight:1oz (35µm), 2oz (70 µm)
PCB thickness:20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Immersion gold, HASL, Immersion silver, Immersion tin, Pure gold, OSP, ENEPIG, Bare copper, etc..

Applications of Kappa 438 PCBs:


Kappa 438 laminates find extensive use in a wide range of applications, including:

Wireless Communication Systems:

Licensed Assisted Access (LAA)

Small Cell and Distributed Antenna Systems (DAS)

Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) Communications


Internet of Things (IoT):

Smart Home Automation

Wireless Meters and Monitoring Devices



Conclusion:

Rogers Kappa 438 PCBs offer wireless circuit designers a remarkable solution that surpasses the limitations of FR-4 materials. With their exceptional performance, consistency, and reliability, Kappa 438 laminates provide an ideal balance of price, performance, and ease of fabrication. These laminates are compatible with standard epoxy/glass (FR-4) processes, making them a convenient choice for circuit manufacturing. Whether it's for wireless communication systems or IoT applications, Kappa 438 PCBs provide high-quality, cost-effective solutions that meet the demands of today's technology-driven world.

China Kappa 438 High Frequency PCB With Immersion Gold For Carrier Grade WiFi supplier

Kappa 438 High Frequency PCB With Immersion Gold For Carrier Grade WiFi

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