RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-199.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Rogers RO4835 substrates are hydrocarbon ceramic laminates, a type of antioxidative high frequency materials for applications demanding greater stability at elevated temperatures. It is significantly more resistant to oxidation than other hydrocarbon based materials. RO4835 laminates are designed to offer superior high frequency performance and low cost circuit fabrication. Moreover, RO4835 material provides nearly identical electrical and mechanical properties to RO4350B laminates, which customers have used successfully for many years.
Oxidation affects all thermoset laminate materials over time and temperature. In the long term, oxidation can lead to small increases in dielectric constant and dissipation factor of the circuit substrate.
Features and Benefits
1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.
2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.
3. Tight dielectric constant tolerance results in controlled impedance transmission lines
4. Lead-free process compatible results in no blistering or delamination
5. Low Z-axis expansion results in reliable plated through holes
6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures
7. CAF resistant
Our PCB Capability (RO4835)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4835 |
| Dielectric constant: | 3.48 (10 GHz) |
| Dissipation Factor | 0.0037 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (ED copper) | 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| Dielectric thickness (LoPro copper) | 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
The typical Applications for RO4835 PCB include automotive radar and sensors, point-to-point microwave, power amplifiers, phased - array radar, RF components.
Appendix: Typical Values of RO4835
| Property | RO4835 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -100℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 108 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 7 x108 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 30.2(755) | Z | Kv/mm(v/mil) | IPC-TM-650 2.5.6.2 | |
| Tensile Modulus | 7780(1128) | Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 136(19.7) | Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 186 (27) | Mpa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 31 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.66 | W/m/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.05 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.92 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
RO4835 Rogers RF PCB Board 30mil ED Copper Multilayer PCB
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