Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-506.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.
Applications
-Automotive (Engine room ECU)
-Multilayer and HDI PCB
-Backplanes
-Data Storage
-Server and Networking
-Telecommunications
-Heavy Copper
Key Features
-Low CTE
-High heat resistance
-Excellent CAF resistance
-Good through-hole reliability
Our PCB Capability (IT-180ATC)
| PCB Material: | High Tg, Lead Free High Reliability Epoxy Resin |
| Designation: | IT-180ATC |
| Dielectric constant: | 4.4 at 1GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
General Properties of IT-180ATC
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum | 2.4.8 | lb/inch | |
| A. Low profile copper foil | 5 | ||
| B. Standard profile copper foil | 8 | ||
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.1 | % |
| Permittivity (Dk, 50% resin content) | -- | ||
| A. 1MHz | 2.5.5.9 | 4.5 | |
| B. 1GHz | 2.5.5.9 | 4.4 | |
| Loss Tangent (Df, 50% resin content) | -- | ||
| A. 1MHz | 2.5.5.9 | 0.014 | |
| B. 1GHz | 2.5.5.9 | 0.015 | |
| Flexural Strength, minimum | N/mm2 | ||
| A. Length direction | 2.4.4 | 500-530 | |
| B. Cross direction | 410-440 | ||
| Thermal Stress 10 s at 288°C | |||
| A. Unetched | 2.4.13.1 | Pass | Rating |
| B. Etched | Pass | ||
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE | |||
| A. Alpha 1 | 45 | ppm/˚C | |
| B. Alpha 2 | 2.4.24 | 210 | ppm/˚C |
| C. 50 to 260 Degrees C | 2.7 | % | |
| Thermal Resistance | |||
| A. T260 | 2.4.24.1 | >60 | Minutes |
| B. T288 | 20 | Minutes |
Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm
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