24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-483.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
Multilayer PCB 24 Layer Printed Circuit Board Built On High
Temperature FR-4 With 50 Ohm / 100 Ohm Impedance for Industrial controls
General description
This is a type of high multilayer PCB built on FR-4 substrate with
Tg 170°C for the application of Industrial controls with 24 layer
copper track. It's 3.7 mm thick with white silkscreen(Taiyo) on
green solder mask (Taiyo) and immersion gold on pads. This is also
an impedance controlled PCB with single-end impedance of 50 ohm and
differential impedance of 100 ohm. The base material is from ITEQ
supplying single up PCB. They're fabricated per IPC 6012 Class 2
using supplied Gerber data. Each 10 panels are packed for shipment.
Features and benifits
Excellent thermal reliability and CAF resistance providing
long-term reliability for industrial and automobile application.
Long storage time ( It can be stored for more than 1 year in vacuum
bag)
The signal lines form a constant low impedance to the ground
Micro-section and thermal stress test
16000 square meter workshop
Small quantity order is accepted
ISO9001, ISO14001, IATF16949, UL Certified
We can find its Applications in transmitter, GSM Modem, 3G WiFi Router, phase Shifter, embedded Controller, hard drives.
Printed Circuit Board Capability 2020
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
Parameter and data sheet
| PCB SIZE | 400 x 212mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 24 Layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | TOP LAYER 0.018mm+plating Layer 1 |
| Prepreg 0.1016mm | |
| PLANE 1 --- 0.035mm Layer 2 | |
| CORE FR4 0.1016mm | |
| GROUND 1 --- 0.035mm Layer 3 | |
| Prepreg 0.127mm | |
| SIGNAL 1 --- 0.018mm | |
| CORE FR4 0.1524mm | |
| PLANE 2 --- 0.035mm | |
| Prepreg 0.1016mm | |
| GROUND 2 --- 0.035mm | |
| CORE FR4 0.127mm | |
| SIGNAL 2 --- 0.018mm | |
| Prepreg 0.1524mm | |
| PLANE 3 --- 0.035mm | |
| CORE FR4 0.1016mm | |
| PLANE,GROUND 7 --- 0.035mm | |
| Prepreg 0.127mm | |
| SIGNAL 3 --- 0.018mm | |
| CORE FR-4 0.1524mm | |
| GROUND 3 --- 0.035mm | |
| Prepreg 0.127mm | |
| SIGNAL 4 --- 0.018mm | |
| CORE FR4 0.1524mm | |
| PLANE 4 --- 0.035mm | |
| Prepreg 0.1016mm | |
| GROUND 4 --- 0.035mm | |
| CORE FR4 0.1016mm | |
| SIGNAL 5 --- 0.018mm | |
| Prepreg 0.1524mm | |
| SIGNAL 6 --- 0.018mm | |
| CORE FR4 0.1016mm | |
| PLANE 5 --- 0.035mm | |
| Prepreg 0.1016mm | |
| GROUND 5 --- 0.035mm | |
| CORE FR4 0.1524mm | |
| SIGNAL 7 --- 0.018mm | |
| Prepreg 0.127mm | |
| PLANE 6 --- 0.035mm | |
| CORE FR4 0.1524mm | |
| SIGNAL 8 --- 0.018mm | |
| Prepreg 0.127mm | |
| POWER, RROUND 8 --- 0.035mm Layer 22 | |
| CORE FR4 0.1016mm | |
| GROUND 6 --- 0.035mm Layer 23 | |
| Prepreg 0.1016mm | |
| BOTTOM LAYER --- 0.018mm + plating Layer 24 | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.36 /3.2mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 9117 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | Yes, all of signal layers of 8 copper layers, 50 OHM Impedance Controlled for single ended on 5 mil track & 100 OHM for Differential routes on 5mil / 8 mil |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 3.7mm ±0.10% |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (29.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Via hole filling at BGA required. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
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