High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-480.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
1.1 General description
This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
1.2 Our Advantages
ISO9001, ISO14001, IATF16949, UL Certified;
Prototype to volume Production Capability;
16000㎡ workshop;
30000㎡ output capability per month;
8000 types of PCB's per month;
IPC Class 2 / IPC Class 3;
Eligible products rate of first production: >95%
1.3 Applications of HDI PCBs
Oscilloscope
Wireless Booster
Access Point WiFi
4G WiFi
GSM Router
Card Access Systems
Instrumentation
1.4 Parameter and data sheet
| Number of Layers | 14-Layer |
| Board Type | Multilayer PCB |
| Board size | 220mm x 170mm=4PCS |
| Board Thickness | 2.0 mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 170℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | 18 um (0.5oz) |
| Surface Cu thickness | 35 um (1oz) |
| Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
| Solder Mask Supplier | TAIYO |
| Solder Mask Colour | Green |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Mininum Trace (mil) | 5.8 mil |
| Minimum Gap(mil) | 6.2 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
| Drill Table (mm) | |
| T1 | 0.300 |
| T2 | 0.450 |
| T3 | 0.580 |
| T4 | 0.590 |
| T5 | 0.690 |
| T6 | 0.650 |
| T7 | 1.000 |
| T8 | 1.150 |
| T9 | 1.200 |
| T10 | 1.300 |
| T11 | 1.400 |
| T12 | 1.500 |
| T13 | 1.600 |
| T14 | 1.700 |
| T15 | 2.050 |
| T16 | 2.550 |
| T17 | 3.000 |
| T18 | 3.200 |
| T19 | 3.450 |
1.5 Different Types of HDI PCBs
To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:
1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.
I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.
Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
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