1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
Brand Name:Bicheng
Certification:UL, ISO9001, IATF16949
Model Number:BIC-470.V1.0
Minimum Order Quantity:1PCS
Delivery Time:8-9 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
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Product Details
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Product Details
Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit
Board for USB Charger
1.1 General description
This is a type of 2 layer printed circuit board built on FR-4
substrate with Tg 170°C for the application of USB charger. It's
1.0 mm thick with white silkscreen(Taiyo) on green solder mask
(Nanya) and immersion silver on pads. The base material is from
Taiwan ITEQ supplying 4 up PCB per panel. They're fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 30 panels are
packed for shipment.
1.2 Features and benifits
Outstanding thermal resistance and suitable for lead-free process
Can be horizontal operation and has high efficiency
AOI inspection
Meeting your PCB needs from prototype to mass production.
12 hours quotation
Prototype PCB capability
1.3 Application
Router Wireless
Bluetooth Adapter For PC
Motor Controller
GSM Tracking
Modem HSDPA
1.4 Parameter and data sheet
| PCB SIZE | 120 x 79mm=4PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layes |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+PLATE |
| FR-4 0.8mm | |
| copper ------- 17.8um(0.5oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.5/3.8mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 135 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180A TG>170 |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.0mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Silver, Ag>0.15µm |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
| Property | Thickness<0.50 mm | Thickness≧0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
| 2. At 125°C [257 F] | ||||||
| 3. After Process Solutions | 1.23 (7.0) | 0.80 (4.57) | 1.40 (8.0) | 1.05 (6.00) | ||
| 1.05 (6.0) | 0.70 (4.00) | 1.23 (7.0) | 0.70 (4.00) | |||
| 1.05 (6.0) | 0.55 (3.14) | 1.23 (7.0) | 0.80 (4.57) | |||
| Volume Resistivity, minimum | MW-cm | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.0x1010 | 106 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 5.0x1010 | 103 | 1.0x1010 | 103 | ||
| Surface Resistivity, minimum | MW | 2.5.17.1 | ||||
| A. C-96/35/90 | 3.0x1010 | 104 | -- | -- | ||
| B. After moisture resistance | -- | -- | 3.0x1010 | 104 | ||
| C. At elevated temperature E-24/125 | 4.0x1010 | 103 | 4.0x1010 | 103 | ||
| Moisture Absorption, maximum | -- | -- | 0.12 | 0.8 | % | 2.6.2.1 |
| Dielectric Breakdown, minimum | -- | -- | 60 | 40 | kV | 2.5.6 |
| Permittivity (Dk, 50% resin content) | 5.4 | 5.4 | -- | |||
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | 4.4 | 4.4 | 2.5.5.9 | |||
| B. 1GHz | 4.4 | 4.4 | ||||
| C. 2GHz | 4.2 | 4.3 | 2.5.5.13 | |||
| D. 5GHz | 4.1 | 4.1 | ||||
| E. 10GHz | 4 | 4.1 | ||||
| Loss Tangent (Df, 50% resin content) | 0.035 | 0.035 | -- | |||
| (Laminate & Laminated Prepreg) | ||||||
| A. 1MHz | 0.015 | 0.014 | 2.5.5.9 | |||
| B. 1GHz | 0.015 | 0.015 | ||||
| C. 2GHz | 0.015 | 0.015 | 2.5.5.13 | |||
| D. 5GHz | 0.016 | 0.016 | ||||
| E. 10GHz | 0.017 | 0.016 | ||||
| Flexural Strength, minimum | N/mm2 | 2.4.4 | ||||
| A. Length direction | -- | -- | 500-530 | 415 | (lb/in2) | |
| -- | -- | (72,500-76,850) | -60,190 | |||
| B. Cross direction | -- | -- | 410-440 | 345 | ||
| -- | -- | (59,450-63,800) | -50,140 | |||
| Arc Resistance, minimum | 125 | 60 | 125 | 60 | s | 2.5.1 |
| Thermal Stress 10 s at 288°C [550.4F],minimum | Rating | 2.4.13.1 | ||||
| A. Unetched | Pass | Pass Visual | Pass | Pass Visual | ||
| B. Etched | Pass | Pass Visual | Pass | Pass Visual | ||
| Electric Strength, minimum | 45 | 30 | -- | -- | kV/mm | 2.5.6.2 |
| (Laminate & Laminated Prepreg) | ||||||
| Flammability, | V-0 | V-0 | V-0 | V-0 | Rating | UL94 |
| (Laminate & Laminated Prepreg) | ||||||
| Glass Transition Temperature(DSC) | 175 | 170 minimum | 175 | 170 minimum | ˚C | 2.4.25 |
| Decomposition Temperature | -- | -- | 345 | 340 minimum | ˚C | 2.4.24.6 |
| (5% wt loss) | ||||||
| X/Y Axis CTE (40℃ to 125℃) | -- | -- | 10--13 | -- | PPM/˚C | 2.4.24 |
| Z-Axis CTE | 2.4.24 | |||||
| A. Alpha 1 | -- | -- | 45 | 60 maximum | PPM/˚C | |
| B. Alpha 2 | -- | -- | 210 | 300 maximum | PPM/˚C | |
| C. 50 to 260 Degrees C | -- | -- | 2.7 | 3.0 maximum | % | |
| Thermal Resistance | 2.4.24.1 | |||||
| A. T260 | -- | -- | >60 | 30 minimum | Minutes | |
| B. T288 | -- | -- | >30 | 15 minimum | Minutes | |
| CAF Resistance | -- | -- | Pass | AABUS | Pass/Fail | 2.6.25 |
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
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