Cutting Without Mechanical Stress UV Laser Depaneling Machine For FPC PCB
Brand Name:Winsmart
Certification:CE
Model Number:SMTL300
Minimum Order Quantity:1 set
Delivery Time:5-30 days
Payment Terms:L/C, T/T, Western Union
Contact Now
Add to Cart
Verified Supplier
Location:
Huizhou Guangdong China
Address:
Liwu Industrial Park, Yuanzhou Town, Boluo County, Huizhou City, Guangdong Provice, China.
Supplier`s last login times:
within 25 hours
Product Details
Company Profile
Product Details
UV Laser PCB Cutting Without Mechanical Stress For FPC/PCB Depaneling
UV Laser PCB Cutting Applications:
FPC and some relative materials, FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting
UV Laser PCB Cutting Advantages:
No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards
UV Laser PCB Cutting Specifications:
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 2000kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
UV Laser PCB Cutting Laser Source:
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Powe | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
UV Laser PCB Cutting Features:
1. Effectively control the processing heat effect, and improve the edge collapse and thermal effect of the product.
2. High quality laser, no contact processing, no burr and burr after cutting. Mature process system can accurately calculate and segment the graphics, and realize the process of processing parameters and processing graphics.
3. No stress, ±5μm cutting precision.
4. Import gerber file for easy operation. Alien/line cutting is available.
5. Non-contact, smooth cutting edge.
Cutting Without Mechanical Stress UV Laser Depaneling Machine For FPC PCB
Inquiry Cart
0