SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

Brand Name:FASTPCBA
Certification:ISO9001 / IATF16949 / ISO13485
Model Number:FASTPCBA-004
Minimum Order Quantity:1
Delivery Time:5-8 work days
Payment Terms:D/A, D/P, T/T, Western Union, MoneyGram, L/C
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Active Member
Location: Shenzhen China
Address: 3/F. 1/B, 18-2 Yuquan East Rd. Yulv Village. Guangming New district. Shenzhen. China.
Supplier`s last login times: within 16 hours
Product Details Company Profile
Product Details

PCB Assembly SMT , BGA , DIP Double-Sided Pcb Assembly Factory


Product description:
Specializing in the production of high-precision and high- difficulty double-sided multilayer PCB circuit boards, double-sided multilayer PCB circuit board proofing batch production and processing manufacturers, fastpcba



Our product manufacturing capabilities:

PCB process capability
ItemLarge processing capacitySmall processing capacity
Layers (maximum)2--1820-30
Plate typeFR-4, ceramic plate, aluminum base platePTFE,PPO ,PPE
Teflon, halogen-free sheet, high Tg sheet
Rogers, etc TeflonE-65,ect
Plate mixed pressure4 layers-6 layers6 layers-8 layers
biggest size610mm X 1100mm  
Dimensional accuracy±0.13mm±0.10mm
Board thickness range0.2mm--6.00mm0.20mm--8.00mm
Board thickness tolerance (t≥0.8mm)±8%±5%
Board thickness tolerance (t <0.8mm)±10%±8%
Medium thickness0.076mm--6.00mm0.076mm--0.100mm
Minimum line width0.10mm0.075mm
Minimum distance0.10mm0.075mm
Outer copper thickness8.75um--175um8.75um--280um
Inner copper thickness17.5um--175um8.75um--175um
Drilling hole diameter (mechanical drill)0.25mm--6.00mm0.15mm--0.25mm
Hole diameter (mechanical drill)0.20mm--6.00mm0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)0.05mm
Hole position tolerance (mechanical drill)0.075mm0.050mm
Laser drilling aperture0.10mm0.075mm
Plate thickness aperture ratio10:0112:01
Solder mask typeSensitive green, yellow, black, purple, blue, ink
Minimum solder mask width0.10mm0.075mm
Minimum solder mask isolation ring0.05mm0.025mm
Plug hole diameter0.25mm--0.60mm0.60mm-0.80mm
Impedance tolerance±10%±5%
Surface treatment typeHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger cardChemical sinking tin, OSP

Our production equipment: the advanced level of the equipment determines the product quality and efficiency:


Product 100 testing:


China SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing supplier

SMT DIP Ball Grid Array Assembly BGA Pcb Assembly PCBA Manufacturing

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