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V-Cut PCB Prototype Machine 0.3mm - 3.5mm With Part Count Capacity
Ideal for thick PCBs
Can be used with aluminum , FR4, CEM3 and other substrates
Keeping pace with mid-to-large volume production
Panelized flexible or ultra-thin PCBs
Densely populated PCBs with components located too close to the
score line for standard depanelers to handle
Aluminum and metalized substrates (in addition to FR4 , CEM3 , etc
. )
PCBs are separated by the CWVC-200 dual wedge-shaped knives in one
gentle rocking motion that shears the panel along the score line ,
without stress or damage to the PCBs or components . Even when
metalized circuit boards are processed – such as those populated
with heat-generating LEDs that require heat-dissipating metal inner
layers – this machine will easily make the cut .
Fetures :
Separates boards up to 2.0 mm thick ( with minimum 0.5 mm scoring
depth )
Can be used with aluminum , FR4 , CEM3 and other substrates ,
including substrates with metal inner layers
Separates PCBs with components located up to 0.5 mm from the score
line
Safe for use with flexible and thin PCBs
Smooth , quiet pneumatic-powered unit with foot-pedal activation
Wedge-shaped linear blades contour to v-groove score lines and
operate in a rocking motion
Boards are separated without bending or breaking
No safety risks to operator since there is never a gap greater than
4 mm between the upper and lower blades
Adjust blades to PCB score line using rotary knob
Specifications :
Model | CWVC-200 |
Max separation length | 200 mm |
machine Size | 620*230*400mm |
cutting thickness | 0.3-3.5mm |
Machine weight | 165kg |