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Automated Optical Inspection PCB BF-Planet X Saki AOI Machine
SAKI 2D AOI BF-Planet-X II
For M-size boards, this inline, high-speed, space-saving model, at
only 60cm wide, has the smallest footprint in its class. It handles
boards of 330x250mm and scans them in only 4 seconds.
BF-PLANET XII
By employing large-size telecentric lens optical system,
BF-Planet-XII provides accurate and stable inspection results with
10um resolution. The machines correct brightness over the whole
sample and compensate position aberration in real time while image
is scanned, which will contribute to a stable imaging capability
over time. In addition, a variety of algorithms and lighting types
are available to deal with a wide range of inspection requirements
in industry.
Multiple data handling capabilities are provided such as switching
settings by barcode reading and data output to customers’ data
server in order to cope with line requirements flexibly.
High Resolution Imaging System
With a superior resolution of 10μm and scanning line color CCD
camera, BF-Planet-XII provide accurate and stable inspection
results. Solder fillets on components as small as the high density
mounted 01005(0402) chip, as well as IC’s with 0.4mm pitch lead are
easily inspected and analyzed.
High Throughput
BF-Planet-XII has Saki’s original alternate scanning sys- tem that
captures several lighting images in one scan- ning. Newly developed
color capturing system enable to make scanning speed twice faster
than previous model. It takes only 9 seconds to capture M-size
board [250mm
× 330mm]. Overall tact time including inspection also be- come
shortened dramatically.
Advantage of Line Scan Visual Inspection
Model | SAKI 2D AOI BF-Planet-XII |
Resolution | 10μm |
Board Size | 50×60 - 250×330mm, 2×2.4 - 10×13in. |
Board Thickness | 0.6 - 3.2mm, 24 - 126mils |
Board Warp | +/-2mm, 79mils |
PCB Clearance | Top: 40mm, 1.57in. Bottom: 40mm, 1.57in |
Rotated Component Support | Available for 0 - 359°rotation (unit of 1°) |
Inspection Categories | Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign material, Absence of solder, Insufficient solder, Lifted lead, Lifted Chip, and Fillet defect. Each defect name can be changed freely by system function. |
Tact Time*1 *2 | Approx. 18sec. (250×330mm) |
Image Scanning Time*1 | Approx. 9sec. (250×330mm) |
Camera (Image Processing) | Line color CCD camera |
Lighting | LED lighting system |
Transfer Conveyor Method | Flat belt transfer |
Transfer Conveyor Height | 900+/-20mm, 36+/-0.8in |
Transfer Conveyor Width Adjustment | Manual |
Operating System | Windows XP English Version |
Optional System | BF-Editor / BF-RP1 / BF-Monitor / BF-View |
Optional | 2D Barcode Recognition, Journal Printer, Automatic Transfer Conveyor Width Adjustment |
Electric Power Requirement | Single Phase ~100 - 120V / 200 - 240V +/-10%, 50/60Hz, 500VA |
Air Requirement | 0.5MPa, 5L/min (ANR), 73PSI, 0.18CFM |
Usage Environment | 15°C(59F) - 30°C(86F) / 15 - 80% RH (Non-condensing) |
Noise Level | 57.5dB |
Dimensions W x D x H | 600 × 915 × 1270mm, 24 × 36 × 50in |
Weight | Approx. 275kg, 607lbs |
*1 If PCB size is smaller than 250x330mm, Image scannig time will be shorter than this values. *2 Including Image Scanning Time. |
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