SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
Brand Name:MC SILICONE
Certification:MSDS , SGS， Reach
Model Number:MC-160
Minimum Order Quantity:100
Delivery Time:5-10 working days
Payment Terms:L/C, , T/T, Western Union, PayPal ,
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Location:
Dongguan Guangdong China
Address:
No.2, Zhouliao Road, Langzhou Industrial Zone, Changping, Dongguan, Guangdong, China
Supplier`s last login times:
within 30 hours
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Product Details
Silicone potting compound for electronic encapsulation electronic components
Description of Electronic Potting Silicone Compound& Encapsulates
RTV160 is a two-component room temperature cure potting compound with mix ratio of 1:1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It’s suitable for encapsulating of LED displayers, power module and electronics components, etc.
Features of Electronic Potting Silicone Compound& Encapsulates
Easy mix with 1:1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent
Using Instructions of Electronic Potting Silicone Compound& Encapsulates
1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.
2. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.
3. Curing: room temperature cure or heat-up cure is both workable.
It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contactwithmoisture in the air.
Technical datasheet of Electronic Potting Silicone Compound& Encapsulates
| Item No. | RTV160 |
| Before curing | |
| Appearance | A: brick red B: transparent |
| Viscosity (mPa.s 25°C) | 3000~6000 |
| Density (g/cm3 ) | 1.57±0.02 |
| Working life (min 25°C) | 30 |
| Curing time (hrs) | 24 |
| Heat-up at 100°C (min) | 10 |
| After curing | |
| Hardness (shore A) | 50~60 |
| Dielectric breakdown voltage kv/mm 25°C | ≥20 |
| Volume resistivity ohm*cm | 1*1015 |
| Tensile Strength Mpa | ≥0.6 |
| Thermal conductivity cm/°C | 0.525*10-3 |
| Working temperature °C | -30~200 |
Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.
Packaging of Electronic Potting Silicone Compound& Encapsulates
Packs are available in 20kg and 200kg per drum.
Storage & Transportation of Electronic Potting Silicone Compound& Encapsulates
Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
It can be stroked and transported as non-dangerous goods.
SGS Electronic Encapsulation Silicone Casting Compound Room Temperature Cure
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