High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

Brand Name:YDY
Certification:ISO13485, IATF16949, ISO9001,IOS14001
Model Number:HDI1
Minimum Order Quantity:1pcs
Delivery Time:1-20 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Location: Shenzhen China
Address: 深圳市宝安区福永凤凰西区202号信诺大厦401
Supplier`s last login times: within 27 hours
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Product Details

HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias


HDI PCB Board Capabilities include:


Laser Drilled Microvias
Sequential Lamination
Stacked Microvias
Blind & Buried Vias
Via-in-Pad
Laser Direct Imaging
.00275" Trace/Space
Fine Pitch (Down to .3mm)



PCB Manufacture Capacity

FeatureCapability
Service Type

HDI PCB Board Laser Drilled Microvias 0.06 Diameter Blind & Buried Vias

Quality GradeStandard IPC 2
Number of Layers4 - 48ayers
Order Quantity1pc - 10000+pcs
Build Time2days - 5weeks
MaterialFR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board SizeMin 6*6mm | Max 457*610mm
Board Thickness0.4mm - 3.0mm
Copper Weight (Finished)0.5oz - 2.0oz
Min Tracing/Spacing2.5mil/2.5mil
Solder Mask SidesAs per the file
Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
Silkscreen SidesAs per the file
Surface FinishHASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS
Min Annular Ring4mil, 3mil - laser drill
Min Drilling Hole Diameter6mil, 4mil - laser drill
Max Exponents of Blind/Buried Viasstacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Other TechniquesFlex-rigid combination
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1m²)

High Quality HDI PCB Manufacturing


HDI PCB designs push the limits of technology and Advanced Circuits is at the forefront of innovation, satisfying the most rigorous requirements.
The demand for HDI PCB manufacturing has been increasing due to the advancements in technology and the many benefits HDI PCBs provide for high-tech applications. Fitting more technology in less space with fewer layers creates limitations for many PCB manufacturers that do not have the specialized equipment and the capacity for advanced features, finer lines, and tighter tolerances. HDI printed circuit board designs utilize a combination of advanced features like microvias, blind vias, via-in-pad, along with stacked and staggered vias to maximize the the space of the board while increasing its performance and functionality.


]High quality and precision with in-house laser drill capabilities that include precise depth control. Laser direct imaging (LDI) capabilities ensure exacting registration and all multilayer inner cores receive a thorough check using Automated Optical Inspection (AOI) units for excellent defect detection of the finest features.



Shenzhen Yideyi Technology Co., Ltd can provide one-stop service, from the PCB production, the components purchasing to thecomponents assembled.​




FAQs:

1, Do you offer quick turn PCB Assembly ?
Yes, we offer 24 hours quick turn PCB Assembled Solution without sacrifice the quality of the PCB Board.

2, Do you offer X-Ray capability ?
Yes, we inspect the boards using X-ray and therefore offer total reliability.

3, Do you offer conformal coating service ?
Yes, conformal coating is a part of our value-added services.

4, Do you offer testing service ?
Yes, we offer robust functional testing that adds to the product reliability.

5, Do you offer IPC 610 or J-STD Quality inspections ?
Absolutely, we offer these inspections as per client requirements.

6, Do you offer first article inspection ?
Yes, basis client requirements, we are well equipped to offer first article inspection.

7, What is your standard turnatound time for PCB Assembly ?
Our standard turnaround time for PCB Assembly is 3 weeks.

China High Density Interconnect Pcb Hdi Technology 0.06  Diameter Blind   Buried Vias supplier

High Density Interconnect Pcb Hdi Technology 0.06 Diameter Blind Buried Vias

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