Home /PCB & PCBA /

Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly

Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly

Brand Name:YDY
Certification:ISO13485, IATF16949, ISO9001,IOS14001
Model Number:M-025
Minimum Order Quantity:1pcs
Delivery Time:1-15 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Contact Now

Add to Cart

Active Member
Location: Shenzhen China
Address: 深圳市宝安区福永凤凰西区202号信诺大厦401
Supplier`s last login times: within 27 hours
Shipping
lt's easy to get a shipping quote! Just click the button below and complete the short form.
Get Shipping Quote
Product Details Company Profile
Product Details

Multilayer Film Rigid Flexible PCB Materials Sourcing Circuit Board Assembly


YDY offers complete solutions for product:


• SMT & PTH & BGA PCBA, PCB Board assembly

• PCBA and enclosure design

• Components sourcing and purchasing

• Double Sided PCB Manufacturing Process

• Plastic injection molding

• Metal sheet stamping

• Final assembly

• Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

• Custom clearance for material importing and product exporting

• Gerber File And BOM List PCBA

• PCBA copy

PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board


Our service:


1.Professional engineer team --help you to check design and do engineering before production.
2.After-sales service--every problem you have will get our professional advice and solution.
3.Constant follow up-- make us have the fast reaction of your requirement.
4.Perfect FPC production industry--provide high quality and competitive price FPC.
5.Inspection agency--has the most authoritative UL and ISO inspection agencies in the world.


Rigid Flexible PCB Capability


NO
Item
Process capability
1
product type
FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB
2
Max layer count
20 layers
3
Min base copper thickness
1/3 OZ (12um)
4
Max finished copper thickness
10 OZ (350um)
5
Min trace width/spacing(Inner layer)
2/2mil (0.05mm)
6
Min trace width/spacing(Outer layer)
2/2mil (0.05mm)
7
Min spacing between hole to inner layer conductor
6mil (0.15mm)
8
Min spacing between hole to outer layer conductor
6mil (0.15mm)
9
Min annular ring for via
4mil (0.1mm)
10
Min annular ring for component hole
4mil (0.1mm)
11
Min BGA diameter
4mil (0.1mm)
12
Min BGA pitch
4mil (0.1mm)
13
Min hole size
0.15mm(CNC); 0.1mm(Laser)
14
Max aspect ratios
8.01
15
Min soldermask bridge width
4mil (0.1mm)
16
Soldermask/circuit processing method
Film
17
Min thickness for insulating layer
1mil (0.025mm)
18
HDI & special type PCB
HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc
China Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly supplier

Bare Rigid Flexible Printed Circuit Board Soldering Bom Pcb Assembly

Inquiry Cart 0