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China PCBA Circuit Pcb Board Layout Electronics Design Services
Shenzhen Yideyi Technology Limited Company. is a high-tech R&D
company with pcb production base, specialized in electornic design,
and production.
The scarcity of high-level design and verification resources
affects the development of many electronic designs. YDY can serves
as a natural extension of your engineering team to achieve faster
time-to-market and high electronic innovation. From your concept
till final product, we can provide you a one stop solution service.
From concept to schematic design, software deisng, pcb layout,
selection of components, enclosure design, package design, test
guide, YDY employs a large team of experienced electronic design
engineers who have well understanding of the certification system
in western country, to do the design based on your idea and market
requirement. With excellent project management skill, open
communication, constant follow-up, and our customer-centered
values, we’ll make the electronic development go smoothly.
Your benefit
Your electrical design needs to be further developed into a device
to prove its function and value in the market. We do your design
lay-out; you benefit from YDY collected knowledge of electronics
manufacturing.
Our Electronic Design and Development Capability
1, Schematic Design. Based on your specification and requirement, our electronic engineer will provide a solution to reach your expect function.
2, Enclosure Design. We’ve an industrial design company partner work with us in this field. Professional, stylish, nice and clean design concept will be handed to you. Of course, all will be based on easy production, less cost and less problem during production.
3, PCB Development. Based on the schematic and certification request, our experienced engineers will provide you the best solution of it.
4, Components Procurement. Cost less and good quality.
5, PCBA Assembly.
6, Enclosure prototype and production.
7, Full product Assembly.
8, Provide Test Method.
PCB Techinecal Capacity
Layers | Mass production: 2~58 layers / Pilot run: 64 layers |
Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm |
Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
Max. Panel Size | 1150mm × 560mm |
Aspect Ratio | 18:1 |
Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
PCBA technical Capacity
SMT | Position accuracy:20 um |
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height::25mm | |
Max. PCB size:680×500mm | |
Min. PCB size:no limited | |
PCB thickness:0.3 to 6mm | |
PCB weight:3KG | |
Wave-Solder | Max. PCB width:450mm |
Min. PCB width: no limited | |
Component height:Top 120mm/Bot 15mm | |
Sweat-Solder | Metal type :part, whole, inlay, sidestep |
Metal material:Copper , Aluminum | |
Surface Finish:plating Au, plating sliver , plating Sn | |
Air bladder rate:less than20% | |
Press-fit | Press range:0-50KN |
Max. PCB size:800X600mm | |
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
PCBA Application: