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Stable 8 Zones Lead Free Reflow Oven Equipment, SMD Reflow Oven for Assembly
The Parameter Date of Reflow Oven RF-800I
8 Zones Reflow Oven | RF-800I |
Length of Heating Zones | 2950 MM |
No. of Heating Zones | Top 8 & Bottom 8 |
Dimension | 5000*1300*1450mm ( L*W*H ) |
Max. Width of PCB | 50 ~ 400 MM |
Convryor Speed | 20-2000 MM/min |
Mesh Width | 450 MM |
Normal Operation Power | About 9KW |
PCB Conveyor Method | Mesh and Rails |
No. of Cooling Zones | 2 |
Nozzle Plate | Stainless Steel Plate |
Temp. Setting Range | ~320C |
Power Supply | 380V 50HZ / 220V 60HZ |
Temperature Control Precision | ± 1C |
Features of 8 Zones Reflow Oven
1, Fully meet various requirements for lead free SMT process
especially BGA, CSP packaging.
2, User-friendly interface, Windows operation system with English
version
3, PLC+PID Close loop control mode to get reliable temperature
control and stable profiles
4, Independent and high efficient air management system for 8
couples of top/bottom zones to make the production more flexibly
and effectively.
5, Tailor -made rails with special treatment to avoid the bending
and deforming
6, Standard with protection function after power off which shall
ensure the PCB come out from chamber without damage or heating
impact< Powerful software can monitor the temperature at real
time and take the profile on line, at same time to analysis, save
or print out the profiles.
7, Unique air management system with multi-layer of thermal
insulation chamber to obtain the lowest power consumption.
Option of Reflow Oven
1. Double conveyor system the inphase parallel double conveyor of
chains and mesh, the width of the conducting racks can be adjusted
individually.
2. Centering support system.
Picture Showing of Reflow Oven