BGA CSP Components SMT Reflow Oven 7.5KW Reflow Soldering Equipment For SMT Line

Brand Name:UA
Certification:CE
Model Number:RF-H700Ⅰ
Minimum Order Quantity:1 unit
Delivery Time:5-30 days
Payment Terms:T/T
Contact Now

Add to Cart

Verified Supplier
Location: Hong kong China
Address: UNIT 408B, LIPPO SUN PLAZA, 28 CANTON ROAD, TSIM SHA TSUI, KOWLOON, HONG KONG.
Supplier`s last login times: within 23 hours
Product Details Company Profile
Product Details

Advanced SMT Reflow Oven Machine 7 Zones


Features

1. Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature.

2. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity,

with auto chain lubricating system

3. The upper cover of the oven is raised by electric handspike, safe and credible.


4. Even temperature and high heat compensation efficiency, especially suitable for soldering

of BGA CSP components.


5. The patent wind wheel design can ensure wind speed windspeed can be adjusted by

frequency conversion


6. All temperature zone applies coercive independent cycles PID controls and up & down

heating style, which make the temperature of theoven accurate with a large heat capacity.


7. Automatically monitoring and displaying the working condition of the oven the parameter of the

oven can be modified at any moment


8. Powerful programming software’s controlling system, it can detect the online temperature of PCB

and can analysis save and print the profiles


9. SMEMA compatible


Specifications

ModleRF-H700I
Machine Dimension (mm)4800*1490*1510
Weight (kg)Approx.1900
Heating Zone Length (mm)2582
Running / Starting Power (kw)7.5 / 30
ControlPLC + PC
Temp RangeRoom Temperature ~ 320C
Temp Accuracy± 1C
Temp Deviation± 2C
PCB Width (mm)50 - 400 ( or customized )
Cooling TypeForced-air Coooling
Cooling Zone length ( mm )600
Conveyor TypeChain and Mesh Belt
Conveyor Speed (mm/min )20-1500
Mesh Belt Width ( mm )460 ( or Customized )
Parts HeightOn Baoard 35mm / Under Board 20mm
Power Supply3P/AC 380V OR 3P/AC 220V
Options Available450/500 max PCB width
Central support for big PCB
Extra cooling zone

Product Showing


Package and Shippment

Combing inner vaccum packing with outer wooden packing.


Shipment :By sea, by air,by truck, etc.

Our Services

UA devote to serve customers and meet all their diversified requirements.

1. Provide good equipment with stable technical level, innovative design concept,

precise manufacturing process, reasonable price.

2. Respond to customer in time. Our staff will feedback to you in time. Don’t ignore your questions.

3. One year product warranty.

4. Rich experience in SMT line with over 11 years.

5. The OEM service is available.

6. Low requirement about product OMQ.

China BGA CSP Components SMT Reflow Oven 7.5KW Reflow Soldering Equipment For SMT Line supplier

BGA CSP Components SMT Reflow Oven 7.5KW Reflow Soldering Equipment For SMT Line

Inquiry Cart 0