Low-Profile JEDEC Tray with Less Than 0.76mm Flatness and Pin 1 Markers for High-Density IC Components

Plastic Low-Profile JEDEC Trays High-Density Carriers For IC Components

The Low-Profile JEDEC matrix tray, with its standardized 0.25-inch (6.35mm) thickness, is the workhorse of the microelectronics assembly line. This specific profile is engineered to accommodate 90% of all standard-height components, including popular packages such as BGA (Ball Grid Array), CSP (Chip Scale Package), TQFP (Thin Quad Flat Package), and SOIC (Small Outline Integrated Circuit). The foundation of this system is the unwavering 12.7 x 5.35 inches (322.6 x 136mm) global outline dimension, which guarantees a universal interface with automated handling and feeding equipment. By optimizing the thickness, the low-profile trays maximize vertical storage and feeder capacity, a critical factor in high-volume manufacturing environments. These trays are constructed from high-strength, ESD-safe polymers—often black for conductivity—to protect sensitive ICs from static discharge. Their design focuses on minimum twist and superior dimensional stability, ensuring that the precise location (pitch) of every component pocket remains accurate for high-speed automated pick-and-place operations.

Features & Benefits:

Low-Profile JEDEC trays offer a balance of high-density storage and precision component handling.

1. Vertical Density Optimization

2. Vacuum Pickup Efficiency

3. Pin 1 and Orientation Markers

4. Interlocking Stacking

Technical Parameters:

Applications:

Low-Profile JEDEC trays are indispensable for a variety of critical manufacturing processes.

2. High-Volume SMT Assembly

2. Component Testing

3. Moisture Sensitive Device (MSD) Handling

Customization:

The flexibility of the internal matrix is key to serving the broad range of components that fit within the low profile.

• BGA-Specific Design: For BGA packages, which require inspection of the solder balls, the internal cell design is often customized to make the tray "flippable." This allows components to be loaded face-up for processing and then quickly flipped and secured face-down in the same tray for storage or inspection.
• Cell Geometry Optimization: The capacity (maximum number of parts) is fully customized based on the component's size and geometry, maximizing the use of the 12.7 x 5.35 inch footprint for a specific device. Customization ensures a snug, secure fit for leadless devices like QFN and LGA, preventing any movement.
• Material Tailoring: Custom material options are available to match process requirements. While the default may be mid-temp ESD polymer, customization allows for selection of materials with specialized chemical resistance for specific cleaning processes or enhanced properties for UV or laser marking compatibility.
• Engraving and Marking Space: The trays offer designated space for permanent, custom engraving or marking (e.g., logos, part numbers, or serialization) to aid in inventory management and traceability throughout the manufacturing process.