High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven
Brand Name:Hiner-pack
Certification:RoHS、ISO
Model Number:HN24140
Minimum Order Quantity:500pcs
Delivery Time:1~2 Weeks
Payment Terms:100% Prepayment
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Location:
Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
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within 1 hours
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Product Details
High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven
This ESD-Safe JEDEC Tray is specifically designed for the protection and handling of semiconductor devices across automated manufacturing lines. Built from high-performance conductive polymer, it ensures stable electrostatic control while maintaining precise pocket geometry for secure part retention. Its rigid structure and uniform layout provide reliable compatibility with robotic arms, pick-and-place systems, and tray elevators, making it an ideal solution for high-volume, precision-driven production environments.
Features & Benefits:
JEDEC Standard Compliance – Fully meets JEDEC outline specifications to ensure interchangeability with global handling and packaging systems.
Excellent ESD Protection – Conductive material effectively dissipates static charges, protecting sensitive components during every stage of handling.
Precision-Molded Pockets – Consistent pocket design minimizes component movement, ensuring accurate placement during transport or inspection.
Automation Adaptability – Compatible with robotic sorting systems and tray stackers to streamline automated workflows.
Reinforced Frame Design – Strengthened edges reduce flexing and warping, maintaining dimensional accuracy through repeated cycles.
Stacking Efficiency – Interlocking edges enable stable vertical stacking, simplifying storage and transport logistics.
Technical Parameters:
| Brand | Hiner-pack |
| Model | HN24140 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x7.62mm |
| Cavity Size | 5.0*6.4*1.03mm |
| Matrix QTY | 11*28=308PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
Applications:
Widely applied in semiconductor manufacturing, IC assembly, module
testing, and device transportation, this tray provides consistent
performance under both cleanroom and standard production
conditions. It ensures efficient handling of small chips, logic
devices, and analog components while reducing risks of
electrostatic discharge and physical damage. Its compatibility with
automated systems allows manufacturers to optimize production
throughput and maintain process stability.
Customization:
This tray can be modified to accommodate unique device specifications or process needs:
Custom Pocket Geometry – Designed for chips, modules, or special-shaped components requiring non-standard cavity profiles.
Color Options – ESD-safe materials can be customized in various colors for product or batch distinction.
Permanent Marking Options – Incorporate molded batch codes, serial numbers, or customer logos for traceability.
Automation Interface Options – Optional indexing holes, tabs, or side cutouts for enhanced robotic or conveyor integration.
High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven
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