JEDEC Standard IC Trays ESD-Safe Chip Tray For Semiconductor Use

JEDEC Standard IC Trays ESD-Safe Chip Tray For Semiconductor Use

From standard devices to custom modules, our JEDEC trays provide safe, ESD-protected handling every step of the way.

This JEDEC-compliant matrix tray provides a practical and sturdy option for organizing electronic components throughout automated assembly, inspection, and shipping procedures. It is crafted to keep components aligned and shielded in challenging operating environments, thanks to its precision-molded pockets and industry-standard orientation markers that seamlessly work with pick-and-place systems.

Constructed from ESD-safe material, this tray guarantees reliability in diverse settings, from cleanrooms to general production areas. It can be relied upon as a dependable tool across various industries due to its consistent performance.

Features:

Conforms to JEDEC standards for easy adoption across various manufacturing platforms and handling systems.

Conductive material composition offers permanent electrostatic discharge protection for sensitive parts.

Evenly spaced pockets keep parts securely aligned, reducing the risk of misfeeds or handling damage.

Built-in features such as pickup zones, corner chamfers, and orientation tabs support robotic and mechanical handling.

Stable interlocking system prevents tray movement during vertical stacking, whether in storage or transit.

Maintains structural integrity over repeated handling, temperature cycles, and long-term use.

Technical Parameters:

Applications:

This matrix tray is versatile and can be used in a variety of applications. It is ideal for semiconductor packaging, module assembly, quality inspection, and product shipment. The tray facilitates controlled movement of parts between workstations, enables traceability during production, and assists manufacturers in maintaining consistent part orientation through automated workflows.

The reliability of this matrix tray makes it a preferred option in industries like communications, computing, automotive electronics, and consumer devices.

Customization:

Tailored tray versions can be provided to meet diverse product or process needs:

• Modified Pocket Structure: Adapt pocket dimensions and contours to fit custom ICs, sensors, or non-standard device profiles.

• Color Material Options: Choose ESD-safe materials in different colors for process visibility, part type separation, or line control.

• Molded Identification Marks: Add permanent alphanumeric codes, customer-specific logos, or process indicators for improved tracking.

• Feature Adaptation: Include additional tabs, slots, or locator keys for compatibility with proprietary automation or specialty feeders.