Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD

ESD-Proof Tray For Chip Module Packaging And Secure Handling

The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting a variety of microelectronic components including Chip, Die, COG, Optoelectronic devices, and more. These products come in various sizes and materials to suit different needs, with product specifications available in 2 inches and 4 inches. The materials used include Antistatic/Conductive ABS and PC, and can also be tailored to meet specific customer requirements.

Features:

The products are crafted from ESD-safe, non-sloughing, and carbon-powder-free clean polymers.

They are further reinforced with carbon fiber to enhance their strength and ensure permanent ESD protection. This design feature provides added durability and longevity to the products.

With the capability of withstanding bake temperatures of up to 180°C, these items offer versatility in various environments and applications. This high temperature tolerance adds to their practicality and usability.

Available in industry-standard formats, these products can also be customized to meet specific requirements and preferences. This customization option allows for tailored solutions that cater to individual needs.

Technical Parameters:

Specifications:

The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics.

• External size – 2”, 4”, etc.
• Pocket size or pocket count – choosing one will dictate the other
• Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification.

• Component geometry
• Special process requirements
• Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)