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JEEDC IC Tray For CQFP48 Package Chips Meets Environmental And Rohs Requirements
Hiner-pack was founded in 2013,it is a high-tech enterprise which
is integrated Design,R&D,Manufacturing,Sales of IC packaging
and testing as well as semiconductive wafer fabrication process in
automated handling,carrying,transportation to provide customers
turnkey services.
Customized cases : 5G Core Part, Socket, RF Chip, MEMS, Optical
Chip
The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling and testing equipment. They are readily compatible with pick-and-place machines which greatly streamlines the manufacturing process.
While there are standard designs available for JEDEC trays, some manufacturers offer additional customization to accommodate specific device shapes or sizes. This provides flexibility in the manufacturing process and ensures that the trays can be tailored to meet individual requirements.
Customized Size | |
Item Material | ABS / PC / MPPO / PPE... acceptable |
OEM&ODM | YES |
Item Color | Can be customized |
Feature | Durable;Reusable;Rcofriendly;Biodegradable |
Sample | A. The free samples: choosen from existing products. |
B. customized samples as per your design/demand | |
MOQ | 500pcs. |
Packing | Carton or as per customer's request |
Delivery time | Usually 8-10 working days,depends on order quantity |
Term of payment | Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation |
At Hiner-pack, our customized JEDEC TRAY is designed to 100% meet
your IC's specifics, providing tailored protection solutions based
on its chip packaging. Our website showcases our range of JEDEC
TRAY designs for multiple packaging type, including but not limited
to BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and others. We can
deliver effective design solutions and effective wafer-level
package protection for your products.
Hiner-pack specializes in Research & Application for semiconductor
packaging and modified material,which industry chain has integrated
the raw materials,mold,the finished product and dust free clean.Our
engineering technicians can offer from the mold design,material
evaluation,the finished product to the dust free clean in one-stop
to provide a full range of solutions,that can effectively save the
cost for customers.Our company has skillful and well-trained team
in the field of Semiconductor packaging design to work out
customer’s requirements,for instance,different
temperature,color,ESD property and cleanliness class
etc.Experienced product structure engineering team can design
various of IC chip,wafer,precision components packaging methods and
specifications and other special demands to fit you well.
HN PN. | Description | External Size/mm | Pocket Size/mm | Matrix QTY |
HN23123 | CQFP48 | 322.6x135.9x7.62 | 9.3x9.3x2.22 | 8X20=160PCS |
TYPE | Brand | Flatness | Resistance | Service |
BGA IC | Hiner-pack | MAX 0.76mm | 1.0x10e4-1.0x10e11Ω | Accept OEM,ODM |
Product Packaging: