JEDEC Standard Tray Ultrasonic Cleaning Black High Temperature IC Trays
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN23103
Minimum Order Quantity:1000 pcs
Delivery Time:Mold：About 25 Days / Product：7~10 Days
Payment Terms:100% Prepayment
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Location:
Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
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Product Details
JEDEC Standard Ultrasonic Cleaning Black High Temperature IC Trays
Fully compliant with JEDEC standards, yet flexible enough to
support non-standard cavity sizes—just send us your mind.
JEDEC trays are manufactured according to standard dimensions set by the JEDEC organization. This uniformity ensures compatibility among different manufacturers and equipment, making it easier to handle and transport ICs.
JEDEC trays are made to stack efficiently, making them ideal for cost-effective storage and transportation. This stacking feature also maximizes space utilization in shipping and storage environments.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6x135.9x12.19mm |
| Model | HN23103 | Cavity Size | 15*15*4.32mm |
| Package Type | BGA IC | Matrix QTY | 6*14=84PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Features:
Compatibility:
The JEDEC trays are designed to fit standard handling and testing equipment, which simplifies the manufacturing process. These trays can be used with pick-and-place machines and other similar equipment, making it easier to handle and test semiconductor devices. This compatibility ensures that manufacturers can seamlessly integrate these trays into their production line without needing to modify their equipment.
Customizability:
While there are standard designs for JEDEC trays, some manufacturers may offer customized trays to accommodate specific device shapes or sizes. These customized trays are designed to fit the exact specifications of the device being packaged, ensuring optimal protection and performance during transportation and testing. This level of customization provides manufacturers with more options and flexibility in their production process, allowing them to produce a wider range of semiconductor devices.
Applications:
JEDEC trays play a critical role in the semiconductor industry and are commonly used in a variety of applications. One of their primary functions is to aid in semiconductor manufacturing and assembly by securely holding and organizing electronic components during the production process.
In addition to their use in manufacturing, JEDEC trays are also utilized in the testing of electronic components to ensure their functionality before they are integrated into larger electronic systems. This testing process helps to identify any potential issues or defects that could lead to product failures.
Another important role of JEDEC trays is to facilitate the shipping and storage of integrated circuits (ICs) and other sensitive devices. These trays are designed to protect delicate electronic components during transit and help to prevent damage or contamination, thus ensuring that they arrive at their intended destination in optimal condition.
JEDEC Standard Tray Ultrasonic Cleaning Black High Temperature IC Trays
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