JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity

Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray

Optimize handling for QFN, BGA, and custom modules with JEDEC trays built precisely to your product specs.

Application:

1. Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly, and testing.

2. R&D: Storing and testing new products in laboratories and R&D environments.

3. Logistics: Used in supply chain management to securely transport electronic components.

Features & Advantages:

1. Durability: The injection molded material has good durability and impact resistance to provide full protection during transportation.

2. Multi-purpose: Suitable for the storage of a wide range of electronic components, such as integrated circuits (ICs), sensors, modules, etc.

3. Lightweight design: Lightweight design facilitates handling and storage, improving logistics efficiency.

4. Improve reliability: Prevent static electricity from damaging chips and components, and ensure product quality.

5. Reduces loss: Effectively protects components and reduces damage and waste during transportation and storage.

6. Simplify operation: Standardized pallet design facilitates quick identification and handling in production lines and warehouses.

7. Strong compatibility: Suitable for various package types, reducing inventory diversity and simplifying management.

Technical Parameters:

Materials commonly used for JEDEC trays include MPPO, PEI (polyetherimide), PES (polyether sulfone), and PPE.

Below are the characteristics of these materials and their advantages:

1. MPPO
- Characteristics:

Excellent thermal stability and mechanical strength. Suitable for high-temperature environments.

- Advantages:

High temperature resistance: suitable for use in high temperature conditions to prevent deformation.
Excellent electrical insulation: protects electronic components and reduces electrostatic damage.
Chemical stability: maintains stability in a wide range of chemical environments.

2. PEI (Polyetherimide)
- Characteristics:

Very high thermal stability and excellent mechanical properties. Can be used at temperatures up to 200°C.

- Advantages:

High heat resistance: suitable for high-temperature processing and storage environments.
Excellent electrical insulation properties: effectively protects sensitive electronic components.
Excellent chemical resistance: able to resist a wide range of chemicals.

3. PES (Polyether Sulfide)
- Characteristics:

Combines the advantages of PEI, but with better toughness and thermal fluidity during injection molding. Suitable for a wide range of industrial applications.

- Advantages:

Good heat resistance: maintains physical properties in high-temperature environments.
Chemical resistance: good resistance to a wide range of chemicals.
Excellent mechanical properties: provides additional protection during transportation and storage.

4. PPE
- Characteristics:

Good thermal stability and excellent electrical insulation properties.
Higher rigidity and strength.

- Advantages:

Excellent electrical insulation: effectively prevents static damage and protects electronic components.
High temperature resistance: suitable for use in high temperature environments to prevent deformation.
Chemical resistance: able to resist a wide range of chemicals, suitable for different application scenarios.

Customer FAQ:

Question 1: How long does it take to open the mold?

• Sample mold: 20-25 days.
• Soft mold: 12-15 days.
• Hard mold: 15-20 days.
• Hard mold (>200T) 25-28 days.
• Two-color production mold: 25-28 days.

• It depends on the requirement and complexity.

Question 2: What services can we provide?

1.OEM/ODM service.
2. Professional mold design and production service.
3. Provide plastic parts assembly service.
4. Provide plastic parts packaging service.
5. Provide after-sales service.

Question 3: How many kinds of plastic injection products do you produce?

Mainly for consumer electronics, medical facilities, auto parts, digital electronics, computer accessories, semiconductors, labor protection, and other products.

Welcome to the enquiry.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/