High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray

High Precision Anti-Static ESD Memory Integrated Circuit JEDEC Ic Chip STM Tray

Anti-Static MPPO Standard Matrix Tray For PCB Modules Electronic Components

The advantage of JEDEC tray packaging is that it can protect the products from damage and contamination during transportation and storage.TRAY trays can effectively isolate and protect the products from friction and collision, and at the same time, it can also prevent the products from being affected by moisture, dust and other pollutants. In addition, JEDEC trays can be used to display products aesthetically and increase their value and competitiveness.

JEDEC Tray Parameters

1. Materials: Trays are typically manufactured using anti-static materials (e.g., ESD plastic) to ensure that static damage to chips is prevented during transportation.

2. Size and Shape: JEDEC standards specify the specific size and shape of trays to ensure that trays from different manufacturers can be used interchangeably and are suitable for a variety of automated equipment.

3. Compatibility: The trays are designed to be compatible with devices in a variety of package types, making them more efficient in the production and testing process.

4. marking and labeling: according to the standard, the pallet will usually be marked and labeled, in order to facilitate the tracking and identification of the devices in the tray.

Application of JEDEC Tray

1. Semiconductor chips: widely used for bare chip (die) transportation, especially integrated circuits (IC) and other types of semiconductor devices.

2. electronic components: suitable for storage and transportation of all types of electronic components, such as sensors, power amplifiers, etc.

3. automated production lines: in automated assembly and test equipment, the standardized design of the JEDEC Tray enables the equipment to handle and place chips efficiently.

4. Packaging plants: For the transportation of raw materials in semiconductor packaging plants to ensure the safety of chips during the production process.

5. Electronics Manufacturing Services (EMS): In the electronics manufacturing process, JEDEC Tray is used to store and transport components, increasing production efficiency.
R&D Labs: During the R&D phase, JEDEC Tray is used to store and test newly developed semiconductor devices.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/