8 Inch Standard Metal Wafer Dicing Ring Frame Stainless Steel for Semiconductor OEM/ODM

8 Inch Standard Metal Wafer Dicing Ring Frame Stainless Steel for Semiconductor OEM/ODM

From 6-inch to 12-inch wafers, our metal wafer rings can be customized to meet your tool and process specifications.

(1) Material selection.
Made of high quality stainless steel with excellent strength, corrosion and wear resistance.
Stainless steel ensures that there is no contamination during the wafer dicing process.
(2) Dimensions.
Available in 6-inch, 8-inch and 12-inch wafer sizes.
The inside and outside diameters of the frame can be customized for different wafer sizes.
(3) Functional features.
Ensure that the wafer surface is not subject to any mechanical damage or contamination during the dicing process.
Works seamlessly with automated cutting equipment to improve cutting efficiency.

Overall, this stainless steel single wafer shipping frame is a key auxiliary equipment in the semiconductor wafer dicing process. It not only protects the wafer surface, but also ensures the accuracy and consistency of the cutting process.

Technical Parameters:

Applications:

As key equipment in the semiconductor industry, taut rings, wafer baskets and dicing ring frames are widely used in various semiconductor manufacturing and processing processes. Specific applications include.

1. Wafer storage and transportation
Tension rings and wafer baskets are used to safely store and transport semiconductor wafers and protect them from damage.
Automated loading and unloading can be realized to work efficiently with semiconductor equipment.

2.Wafer dicing and scribing
Dicing ring frames provide a reliable fixing and positioning solution for the wafer dicing process.
It ensures that the wafer surface is not mechanically damaged or contaminated during the dicing process.

3.Wafer Cleaning and Wet Processing
Tension rings and baskets made of special materials and surface treatments are suitable for all types of wafer cleaning and wet processing.
They prevent electrostatic interference and chemical corrosion and ensure the cleanliness of the wafers.

4. Thin Film Deposition and Coating
Rings are used to support and hold wafers in place during thin-film deposition, coating and other processes.
This ensures uniformity of film deposition and coating and good process results.