8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN24722
Minimum Order Quantity:50pcs
Delivery Time:2~3 Weeks
Payment Terms:T/T
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Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
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Product Details
8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry
Engineered from aluminum alloys, metal wafer cassettes offer unmatched durability for cleanroom use.
Features:
1. Aluminum with wear-resistant, smooth, hard-coating.
2. Heat-resistant up to 350°C (Al).
3. Smooth slot-entry.
4. Design according to the Semiconductor industry standard.
Applications:
1. In a thermal process environment, wafers are processed in a cassette at temperatures in excess of 110°F (43°C), the upper limit of the typical structural threshold for plastic process cassettes.
This includes Chemical Vapor Deposition (CVD), Rapid Thermal
Processing (RTP), and wafer annealing applications.
Bakeout - Long-term thermal bakeout applications where wafers need
to be left in the oven for multiple days.
2. Process equipment where the wafer insertion temperature (wafer removed from the process tool) exceeds the melting point of the plastic case.
The need for higher throughput reduces the time for wafers to cool and acclimate in the chamber.
3. Internal Environment Cassettes - Cluster tool automation environments where cassettes are idle in a heated vacuum environment (chamber) for multiple process steps.
4. Precision Carrier Requirements - Automated environments in moderate heat require dimensional accuracy that plastic cassettes cannot provide.
Thin Wafer Handling - During thin wafer handling, sharp thin wafers cut into the plastic case. Thick Wafer - Bonding or thick wafer applications where industry standard plastic cassettes cannot be used due to slot size.
Customization is available upon request.
Custom configurations are available (minimum order quantities may apply): EN electroless nickel plating on aluminum profiles for high vacuum applications; flat profile slotting for thin or thick wafers; end wall retaining handles; and dual h-bar configurations for backside wafer processing.
Technical Parameters:
1. Process Aluminum Box: (Al, HC) 8” - 25 Slot, Slant Slot
(Standard).
2. Sizes: select size cover (top), cover (bottom), custom H-BAR
(bottom), H-BAR (top).
3. Aluminum, abrasion-resistant, smooth, hard coating.
4. Smooth grooves and shapes Vacuum vent screws.
5. Designed to SEMI standards.
Product Name | 8 inch 25 Slot |
Product Size | 288(L)*276(W)*205(H)mm |
Capacity | 25PCS |
Component Material | 6061 Aluminum Plate |
Starting position | 12.5 mm |
Slot distance | 6.34 mm |
Packing and Shipping:
1. Weight limitations
The total weight of a single package should not exceed 25 kg.
Convenient for loading and unloading, it meets the loading capacity
of different means of transportation.
2. Size specification
Carton size should be less than 1.5 cubic meters.
Plastic cardboard, steel drums, and other dimensions according to
the actual size of the goods to be determined.
Ensure that the packaging can be loaded smoothly into the
container, aircraft cargo cabin, etc.
3. Documentation management
Prepare a bill of lading, invoice, packing list, and other
necessary documents.
Documentary information is complete and accurate, consistent with
the actual goods.
8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry
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