Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray
Brand Name:Hiner-pack
Certification:ISO 9001 SGS ROHS
Model Number:HN23054
Minimum Order Quantity:1000 pcs
Delivery Time:1~2 Weeks
Payment Terms:100% Prepayment
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Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
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Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray
Each JEDEC tray we deliver can be custom-fitted to your IC's footprint—ensuring secure, ESD-safe transport.
Designed for high-reliability electronics manufacturing environments, this JEDEC matrix tray combines precise component positioning with exceptional durability and static protection. Its uniform pocket structure ensures consistent alignment of parts throughout pick-and-place, inspection, and packaging processes. With key alignment indicators and compatibility across a range of automated equipment, this tray is a practical solution for minimizing handling errors and maximizing workflow efficiency. Whether in high-volume production or custom assembly lines, it ensures components remain secure and undamaged.
Features & Benefits:
• Industry Standard Format: Built to JEDEC matrix specifications, ensuring compatibility with universal tray handling and test systems.
• High-Performance ESD Protection: Composed of materials with stable conductive properties, ensuring protection from electrostatic discharge.
• Consistent Pocket Integrity: Each pocket is dimensionally stable, providing a secure fit that minimizes shifting during transport or processing.
• Automation-Optimized Structure: Integrated features such as vacuum pickup zones and mechanical orientation guides enable seamless robotic handling.
• Strong Stackability: Interlocking tray edges maintain alignment during stacking, reducing the chance of tray slippage or misfeeds.
• Operational Stability: Maintains structural integrity under typical processing environments, including temperature variation and high-cycle usage.
Technical Parameters:
| Usage | Packaging of Electronic Components, Optical device |
| Feature | ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly |
| Material | MPPO, PPE, ABS, PEI, IDP, etc. |
| Color | Black, Red, Yellow, Green, White, and custom color |
| Size | Customized size, rectangle, circle shape |
| Mold type | Injection Mold |
| Design | Original sample, or we can create the designs |
| Packing | By Carton |
| Sample | Sample time: after the draft is confirmed and payment is arranged |
| Sample charge: 1. Free for stock samples 2. Custom Tray negotiated | |
| Lead Time | 5-7 Working days |
| The exact time should be according to the ordered quantity |
Applications:
This tray is widely used in semiconductor fabrication, SMT lines,
testing facilities, and module assembly operations. It facilitates
error-free positioning and handling of a wide array of components,
including ICs, surface mount devices, and hybrid modules. Its
robust design supports both manual and automated workflows,
ensuring part security during inspection, burn-in testing, or final
packaging.
Customization:
To support a broad range of unique part requirements and handling workflows, the tray can be customized in multiple ways:
• Custom Pocket Design: Pocket size and arrangement can be adjusted to accommodate non-standard component shapes or fragile structures.
• Color Customization: ESD-safe tray materials can be produced in various colors for easy part family or line identification.
• Integrated Identification Features: Permanent tray ID markers can be molded during production for traceability and inventory control.
• Modified Edge Profiles: Tray edges and alignment features can be tailored to improve compatibility with specific feeders or automation tools.
Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray
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