Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Product Description:

JEDEC Matrix Tray Dimensions

The universal JEDEC Matrix Trays have an identical outline. Their dimensions are 12.7 inches by 5.35 inches (322.6mm x 136mm).

The low profile trays have a thickness of 0.25-inch (6.35mm) that fits most component standards, including BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC. They can also accommodate components with a body height ranging up to 0.65-inch (16.51mm).

Features:

JEDEC IC matrix trays provide compatibility with most semiconductor manufacturing equipment, making them a reliable and dependable choice. Because trays have a long history and are widely used, support products for these trays are available all around the world.

Essentially, trays are just like containers. JEDEC matrix trays feature an outline that allows them to be stacked, with each tray serving as a cover for the tray beneath it.

JEDEC matrix trays that have loaded components can be easily stored or transported anywhere. They work as process “boats”, supporting the contents while moving them through various process tools and equipment.

Matrix trays from JEDEC offer protection for the parts they carry from mechanical damage. Most of these trays are manufactured with materials that also provide electrical protection from electrostatic discharge (ESD) damage.

Technical Parameters:

JEDEC Matrix Trays provide the perfect solution for the precision handling and protection of your parts in an automated environment. By arranging components in a organized structure, they streamline automation and related programming jobs, making them popular among companies handling semiconductors, other types of electronic components, optical and photonic products, and mechanical parts. Pick and place automation and utilization of standardized process equipment are the primary reasons why companies choose to use JEDEC Matrix Trays. The vast majority of the trays are manufactured using ESD-safe engineering plastics.

Applications:

Hiner-pack JEDEC TRAY SERIES are cardboard box trays specifically designed for IC packaging. They are certified by ISO 9001 SGS ROHS and come in a minimum order quantity of 500. They are made of MPPO.PPE.ABS.PEI.IDP and come in a black color. Their surface resistance is 1.0*10e4-1.0*10e11Ω and they are stackable. They are packed in 80~100pcs/carton, and the delivery time is 1~2 weeks with 100% prepayment. The supply ability is 2000PCS/Day. Core tray racking suppliers can provide a variety of services and products to meet the needs of different customers.

Customization:

Hiner-pack offers customized services for its Jedec IC Trays series, which are widely used for Electronic Components IC Chips, Apple Tray Making Machine, Grid Cable Tray, Automated IC Tray and other applications. These trays are ISO 9001 SGS ROHS certified with a minimum order quantity of 500 and come with a variety of material options including MPPO, PPE, ABS, PEI and IDP. Other features of the trays include a height of 7.62mm, a tray weight of 120-200g, a surface resistance of 1.0*10e4-1.0*10e11Ω and compatibility with various IC types such as BGA, QFP, QFN, LGA and PGA. Packaging is 80-100 pieces per carton and delivery time is 1-2 weeks with 100% prepayment as the payment term. The daily supply ability is 2000 pieces.

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