Standard Square Matrix Waffle Pack Chip Tray Match Lid Clip Environmentally Friendly

Standrad Square Matrix Waffle Pack Chip Tray Match Lid Clip

Hiner-pack has many years of design and manufacturing experience in the field of injection molding products. We produce a wide range of waffle pack to meet the automation equipment requirements of many semiconductor customers.

Our products are available in a variety of sizes and materials to meet customer requirements such as high temperature baking,impact resistance ,ect.To provide products with a full range of electrostatic protection, as well as safe and convenient transportation.

Details of the HN21123 Chip Tray

The HN21123 Waffle pack is designed for small-scale production and storage of small series of components. Like the JEDEC trays, the waffle pack have a chamfer corner to indicate orientation. The step sizes (from pocket to pocket) in the horizontal and vertical direction are also copied from JEDEC trays.

The chip tray is mainly made of PC. The material has good consolidation and can protect customers' electronic products well.In addition, multiple trays can overlap, increasing the storage of electronic components, PCB board and dust-free workshop parts, thus saving transportation costs.

Application of HN21120 Chip Tray

Semiconductor Display Technology

Electronic Component Packaging Optical Device Packaging

Service of IC Tray Manufacturer

1. We have sample stock, also can help the client to choose which type is suitable for them.

2. We will reply you in any time if you have questions.

3. Choose suitable product for clients according to clients' requirement.

4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: How about batch order production?
Ans: Normally 5-8 days or so.
Q6:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/