ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip

The Waffle pack is an ideal tray for storing and transporting tiny electronic components because of its permanent anti-static properties. At the same time, it also has good mechanical strength and heat resistance, which will not be affected by the environment, time and temperature.

Because the product is prone to friction during storage and transportation, the ABS chip tray can effectively release the static charge accumulated on the surface of the object. If the packaging does not have anti-static properties, the product quality may be affected during transportation and even been damaged.

Details about The HN21118 Waffle Pack

The HN21118 waffle pack is tray made of industrial plastic ABS. It has a variety of excellent properties, such as good dimensional stability, heat resistance, low temperature resistance and excellent anti-static electrical properties. In addition, the resistance to chemical corrosion is also very strong, which makes it a very widely used industrial plastics.

The waffle pack is small in size,light in weight, suitable for transferring or loading, samples for testing. The matrix 10*20 can hold more products and saves the transportation cost.It is the best choice for customers to transport and store their products.

Application of the HN21118 Black 2 inch Chip Tray

Electronic Components Semiconductor

Embedded System Micro and Anon System

Advantages

1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement.

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whats app, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

Hiner-pack was founded in 2013,it is a high-tech enterprise which is integrated Design,R&D,Manufacturing,Sales of IC packaging and testing as well as semiconductive wafer fabrication process in automated handling,carrying,transportation to provide customers turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions.Hiner-pack has mastered special processing technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to launch,and to solve the customer demand for high quality products.

Learn more through our official website https://www.hiner-pack.com/english/