PPE Black ESD Jedec Matrix Trays Electronic Components Jedec IC Trays

PPE Black ESD JEDEC Matrix Trays For Electronic Components

ESD JEDEC Matrix Tray is the packaging tray used by the enterprise for Electronic components packaging test.

The materials required for the tray are conductive, anti-static, high temperature resistance, high strength and other characteristics. Electronic components have high material requirements,so PPE plus carbon fiber reinforcement materials are generally selected. This can well meet the material performance requirements of IC antistatic tray.

Details about The HN21089 PPE Black ESD JEDEC Matrix Trays For Electronic Components

The HN21089 is made of PPE and mixed materials, which ensures that the JEDEC standard tray is very strong with minimal warping control. The 3 x 5 matrix design allows automatic equipment to pick up loaded products. When designing a tray for a rectangular package,the longest dimension of the package is oriented parallel to the longest length of the tray to maximize tray pocket density The 45-degree chamfer is also easier for equipment to identify and locate, reducing labor costs.

2.Application of The HN21085 JEDEC Matrix Tray

IC Component Electronic Component

Semiconductor Micro and Nano systems and Sensor IC etc

3.Reference to temperature resistance of different materials

4.Advantages of Jedec tray

1.Suitable for components or devices daily turnover or long-distance freight.
2.Can be stacked more layers;
3.Can be washed at high temperature;
4.Plastic waterproof, moisture-proof, improve the storage time of components;
5.No extrusion and breakage, Better protection components；
6.Reusable, quality assurance.

5.FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize

the project depending on the specific time.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/