Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN21084
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Supplier`s last login times:
within 1 hours
Product Details
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Product Details
Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray
Get waffle packs built for your process—stackable, ESD-safe, and dimensionally stable.
The use of our products is antistatic raw material, the permanent antistatic performance and short antistatic coating products, even if the product have been unable to use, waste, still has the antistatic performance, we pursue the best quality guarantee, before or after using components will not cause any damage to the customer, the greatest degree of protection you need chips or electronic components.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 101.6*101.6*4.5mm |
| Model | HN21084 | Cavity Size | 13.2*0.8*0.32mm |
| Package Type | N/A | Matrix QTY | 34*5=170PCS |
| Material | PC | Flatness | MAX 0.1mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS/SGS |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Application:
Semiconductor Electronics; Component Factories; SMT Surfacing Factories; Optical Industry
Advantages:
1. Lightweight, saving transportation and packaging costs;
2. Size specification, compatible with any 2 ", 3 ", or 4" Waffle
Pack Feeder Machine;
3. Good anti-static performance, effectively ensures that the
product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature
automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production
conditions of products;
6. Matrix arrangement design, under the premise of protecting the
product, the maximum capacity design, and cost saving;
7. Edge chamfer design effectively prevents stacking errors and corrects the direction of placement.
FAQ:
Q1: Are You a Manufacturer or a Trade Company?
A: We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What is the material of your product?
A:ABS, PC, PPE, MPPO, PEI, HIPS...etc.
Q3: Can you help with the design?
A: Yes, we can accept your customization and do the packaging for you according to your requirements.
Q4: How can I get the quotation for the custom products?
A: Let us know the size of your IC or component thickness, and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
A: Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.
Q6: Could you put my logo in our product?
A: Yes, we can put your logo on our product. Show us your logo first, please.
Q7: When can we get the samples?
A: We can send them right now if you are interested in something we have in stock, and the project depends on the specific time.
Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray
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