JEDEC Outline MPPO Material BGA Matrix Tray With Standard Pocket Design

JEDEC Outline BGA Matrix Tray With Standard Pocket Design

Electrostatic discharge (ESD) even a small spark is strong enough to kill electronic components on the spot and can cause serious production accidents.This leaves the product that customers depend on you to protect unusable. Our ESD matrix tray provide critical protection and simplify the processes of manufacturing, transportation and storage. The ESD component tray must provide two types of protection. First, the tray should prevent electrostatic discharge into the tray or general area of the parts.They do this by isolating static charge from surrounding objects, people, and even the flow of air. One of the most important steps is to prevent static electricity by sliding the tray across the device or surface.

Second, sometimes components are placed in trays that still carry the charge left over from the testing process. If the tray conducts too much electricity, a short circuit will allow a rapid discharge, damaging the component. Packaging that is too conductive can be just as bad as non-conductive packaging, which is why metal tray are bad. While you say you want ESD conductive packaging, But what you really want is a tray that dissipates static or is anti-static. This is a subtle but important difference.

Details About HN21078 Jedec Matrix Tray

The trays are available for many BGA package sizes and are available in various Temperature Range materials including ESD-safe Materials.Our BGA trays offer a unique mix of protection and flexibility for your automated environment.

Reference to temperature resistance of different materials with Jedec Tray

3.FAQ

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans: Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8days or so.
Q5: Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/