Customizable Black Colourful ESD Waffle Pack Chip Trays For IC RF VR Chips

Customizable Black Colourful ESD Waffle Pack For IC RF VR Chips

We design waffle packs around your chip — not the other way around — so every cavity fits with zero compromise.

Plastic ESD waffle pack is made of a layer of molecular polymer material. This material holds your component in place with surface adhesion. It is specially designed to provide safe, clean, and precise packaging for high-value components that are resistant to abrasion and fragile. Even if tilted, vibration, or upside down, it can protect the product perfectly. Our products are widely used in optical crystal, laser crystal, optical communication crystal, optical wave plate, low light level components, semiconductor chip, electronic chip, and biological chip packaging.

In addition, its operating temperature can be adapted to between -40 and 220 degrees Celsius. For 10 years, Hiner-pack has been providing standard or non-standard packaging solutions for many enterprises around the world with its cutting-edge technology in design and rich experience. We are involved in semiconductor products, data storage, and many other industries. We can make a variety of specifications and sizes of waffle packs. The ESD waffle pack is specially designed for chip transportation.

2-inch waffle pack is typically used to carry smaller chips. This not only realizes convenient transportation but also can carry a large number of chips. At the same time, our products are composed of a series of covers, clips, and other corresponding accessories. High-quality and complete service packaging ensures the transfer, transportation, and storage of customers' products.

Technical Parameters:

Advantages:

1. Flexible OEM service: We can produce products according to the customer’s sample or design.

2. Various Materials: The material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding, Production.

4. Comprehensive customer service: from customer consultation to after-sales service.

5. 10 years’ experience of OEM for USA and EU customers.

6. We have our own factory, and the factory has ISO 9001.ROHS, SGS, and other certificates.

7. Short lead time, generally available in stock.

FAQ:

Q1. Are you a manufacturer or a trade company?

A: We are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2. How to place an order?

A: Firstly, please provide the Material, Thickness, Shape, Size, and Quantity to confirm the price. We accept trial orders and small orders.

Q3. What are your terms of delivery?

A: EXW, FOB, CFR, CIF.

Q4. How about your delivery time?

A: Generally, it will take 7-10 working days after confirming the sample. The specific delivery time depends on the items and the quantity of your order.

Q5. Can you produce according to the samples?

A: Yes, we can produce by your samples or technical drawings.

Q6. What is your sample policy?

A: We can supply the sample if we have similar products in stock; if no similar products, customers shall pay the tooling cost and the courier cost, the tooling cost can be returned according to the specific order.

Q7. Do you test all your goods before delivery?

A: Yes, we have a 100% test before delivery

Q8: How do you make our business a long-term and good relationship?

A: 1. We keep good quality and competitive prices to ensure our customers benefit.

2 We respect every customer as our friend, and we sincerely do business and make friends with them, no matter where they come from.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/